XC3S1000-4FG676C

The XC3S1000-4FG676C is an AMD Spartan®-3 Field Programmable Gate Array (FPGA) provided in a 676-ball BGA package. It delivers 17,280 logic elements with approximately 0.44 Mbits of embedded memory and a high I/O count, making it suitable for designs that require mid-range programmable logic capacity in a compact surface-mount form factor.

Key hardware parameters include a nominal core voltage range of 1.14 V to 1.26 V, support for up to 391 I/O pins, a package footprint of 676-FBGA (27×27), and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  17,280 logic elements provide a substantial fabric for implementing custom digital logic, state machines, and glue logic within a single device.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM for data buffering, FIFOs, and small embedded storage needs.
• I/O Density  Up to 391 general-purpose I/O pins to support multiple external interfaces, parallel buses, and board-level connectivity.
• Gate Equivalent  Device specified at approximately 1,000,000 gates for quick comparison to other logic solutions.
• Package and Mounting  676-ball FBGA package (27×27) optimized for surface-mount assembly in space-constrained designs.
• Power  Core supply range of 1.14 V to 1.26 V to match system power budgeting and rail design.
• Temperature and Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS-compliant construction for environmental regulatory alignment.

Typical Applications

• Custom Digital Logic  Implementation of application-specific processing, protocol bridging, and control logic where reprogrammability and deterministic behavior are required.
• High-Density I/O Interfacing  Aggregating and routing multiple external signals, parallel buses, or mixed-interface systems using the device's extensive I/O resources.
• Embedded Memory Buffering  On-chip RAM used for packet buffering, small data queues, and intermediate storage in data flow architectures.

Unique Advantages

• Significant Logic Density: 17,280 logic elements enable complex designs without resorting to multiple devices, reducing board-level component count.
• Substantial I/O Count: 391 I/Os provide flexibility for multi-interface designs and board-level integration of sensors, peripherals, and buses.
• Integrated On-Chip RAM: Approximately 0.44 Mbits of embedded memory supports local buffering and reduces external memory requirements.
• Compact BGA Packaging: 676-FBGA (27×27) offers a space-efficient footprint for systems where PCB area is at a premium.
• Low-Voltage Core: Narrow core supply range (1.14–1.26 V) simplifies power-rail design for the FPGA core.
• RoHS Compliant: Meets common environmental requirements for modern electronic assemblies.

Why Choose XC3S1000-4FG676C?

The XC3S1000-4FG676C positions itself as a mid-range Spartan®-3 FPGA that balances logic capacity, on-chip memory, and extensive I/O in a compact BGA package. Its specifications make it well suited for development and production designs that require programmable logic, substantial interfacing capability, and integrated memory while maintaining a commercial temperature profile.

Designers seeking a commercially graded, RoHS-compliant FPGA with a clear core voltage window and a high pin count will find the XC3S1000-4FG676C an effective option for consolidating functions, reducing BOM complexity, and enabling reprogrammable hardware solutions.

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