XC3S1000-4FG456I

The XC3S1000-4FG456I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD designed for custom digital logic implementation. It provides a balance of logic capacity, on-chip memory and I/O count suitable for embedded and industrial applications requiring reconfigurable hardware.

This device includes 17,280 logic elements and approximately 0.44 Mbits of embedded memory, supports 333 I/O pins, and operates from a core supply range of 1.14 V to 1.26 V. It is supplied in a 456-ball BGA package and rated for industrial temperature operation from -40 °C to 100 °C.

Key Features

• Core Logic 17,280 logic elements to implement custom combinational and sequential logic functions.
• Embedded Memory Approximately 0.44 Mbits of on-chip RAM for buffering, lookup tables, and small data storage needs.
• I/O Density 333 available I/O pins to support multiple interfaces and external peripherals.
• Gate Count 1,000,000 gates, providing a measure of overall device complexity and integration capacity.
• Power Supply Core voltage range of 1.14 V to 1.26 V for defined operating conditions.
• Package & Mounting 456-ball BGA package (supplier device package: 456-FBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Industrial Temperature Rating Specified to operate from -40 °C to 100 °C for environments requiring extended temperature range.
• Regulatory Compliance RoHS compliant to meet lead-free environmental requirements.

Typical Applications

• Custom Digital Logic — Implement application-specific processing and control functions using the device’s 17,280 logic elements and 1,000,000-gate capacity.
• Interface Bridging and I/O Aggregation — Use 333 I/O pins to connect multiple peripherals, sensors and external buses on a single FPGA fabric.
• On‑board Data Buffering — Leverage approximately 0.44 Mbits of embedded RAM for temporary data storage, FIFOs and small memory structures.
• Industrial Control Systems — Industrial-grade temperature rating (-40 °C to 100 °C) and surface-mount BGA package make the device suitable for embedded controllers and monitoring equipment.

Unique Advantages

• Balanced Logic and Memory — The combination of 17,280 logic elements and ~0.44 Mbits of RAM provides a practical mix for many mid-range FPGA designs without external memory in some use cases.
• High I/O Count — 333 I/O pins reduce the need for additional interface components, simplifying board design where multiple peripherals are required.
• Compact BGA Package — 456-ball BGA in a 23×23 supplier footprint enables high-density PCB layouts while keeping the device surface-mount compatible.
• Industrial Temperature Range — Rated operation from -40 °C to 100 °C addresses applications that require extended environmental tolerance.
• Defined Power Envelope — Specified core voltage window (1.14 V–1.26 V) assists in predictable power supply design and system integration.
• RoHS Compliant — Meets lead-free requirements for environmentally conscious designs and manufacturing processes.

Why Choose XC3S1000-4FG456I?

The XC3S1000-4FG456I provides a focused combination of logic density, on-chip memory and high I/O availability in a compact 456-ball BGA package, making it well suited for embedded systems and industrial applications that require reconfigurable logic within a defined power and temperature envelope. Its specifications give designers a clear basis for integrating custom digital functions and interface-rich designs.

This AMD Spartan®-3 FPGA is appropriate for engineers seeking a reliable, industrial-rated programmable device offering mid-range capacity for prototyping, custom control, and interface aggregation while maintaining compact board-level integration and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S1000-4FG456I and support for your design requirements.