XC3S1000-4FGG456I

The XC3S1000-4FGG456I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD. It provides mid-range programmable logic capacity and a high I/O count in a compact ball-grid array package.

With 17,280 logic elements, approximately 0.44 Mbits of embedded memory, 333 I/O pins, and an industrial operating range, this device is suited to designs that require substantial on-chip logic and flexible external interfacing while meeting industrial-grade temperature requirements.

Key Features

• Core Logic Density  17,280 logic elements delivering approximately 1,000,000 gates for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for buffering, LUTs and small data storage needs.
• I/O and Connectivity  333 user I/O pins to support extensive external device interfacing and parallel/serial connectivity options.
• Power  Core voltage supply range from 1.14 V to 1.26 V to match system power architectures.
• Package and Mounting  456-BBGA (456-FBGA, 23×23) surface-mount package for a compact board footprint and high pin density.
• Operating Range and Grade  Industrial grade device with operating temperature range of −40 °C to 100 °C and RoHS compliance.

Unique Advantages

• Substantial on-chip logic: 17,280 logic elements provide the capacity to implement complex custom logic without immediate reliance on external ASICs or CPLDs.
• High I/O count: 333 I/O pins reduce the need for additional interface components, simplifying board-level design for multi-device systems.
• Embedded memory resource: Approximately 0.44 Mbits of RAM supports data buffering and lookup functions directly on the FPGA fabric.
• Industrial temperature rating: −40 °C to 100 °C operation enables deployment in demanding environmental conditions.
• Compact BG A package: The 456-BBGA (23×23) surface-mount package offers high pin density in a space-efficient form factor.
• Manufactured by AMD: Designed and produced by AMD, offering consistency with Spartan®-3 device characteristics.

Why Choose XC3S1000-4FGG456I?

The XC3S1000-4FGG456I occupies a practical position for designers who need mid-range programmable logic with a high number of I/O and on-chip memory, all in an industrial-grade package. Its combination of 17,280 logic elements, approximately 0.44 Mbits of embedded RAM, and 333 I/O pins makes it suitable for projects that require significant integration of custom digital functions within constrained board space.

As a surface-mount 456-BBGA device from AMD, it offers a compact footprint and the stability of a known FPGA family for teams focused on reliability and predictable hardware behavior across temperature extremes.

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