XC3S1000-4FGG676I

The XC3S1000-4FGG676I is a Spartan®-3 field programmable gate array (FPGA) IC from AMD designed for industrial applications. It integrates a substantial logic resource set and on-chip memory to support custom digital processing, control, and I/O-intensive designs.

With 17,280 logic elements, approximately 0.44 Mbits of embedded memory, and 391 available I/O, this device targets use cases that require configurable logic density, broad I/O connectivity, and operation across an industrial temperature range.

Key Features

• Core Logic  17,280 logic elements enabling complex programmable logic implementations and custom digital functions.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for buffering, FIFOs, and small data stores.
• I/O Capacity  391 user I/O pins to support diverse peripheral interfaces and wide external connectivity options.
• Gate Count  Roughly 1,000,000 gates of logic capacity for mixed control, processing, and glue-logic functions.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting  676-ball BGA package (supplier device package: 676-FBGA, 27×27) designed for surface-mount assembly.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• Regulatory  RoHS compliant for lead-free manufacturing and environmental compliance.

Typical Applications

• Industrial Control Systems  Use the device's logic density and industrial temperature rating for motor control, PLC functions, and custom sequencing logic in harsh environments.
• Communication Interfaces  Leverage the high I/O count and on-chip memory to implement protocol bridging, data buffering, and custom interface logic.
• Embedded Signal Processing  Deploy the available logic elements and embedded RAM for deterministic, low-latency processing tasks and data path customization.
• Custom I/O and Glue Logic  Implement board-level integration, timing control, and bespoke peripheral interfaces using plentiful I/O and gate resources.

Unique Advantages

• Industrial-grade operation: Rated from -40 °C to 100 °C to meet temperature requirements for industrial deployments.
• Substantial programmable capacity: 17,280 logic elements and ~1,000,000 gates support complex custom logic and integration of multiple functions on a single device.
• Generous I/O availability: 391 I/O pins simplify system-level integration and reduce the need for external interface components.
• Integrated on-chip memory: Approximately 0.44 Mbits of RAM for buffering, temporary storage, and small data structures without external memory.
• Compact BGA package: 676-ball FBGA (27×27) provides a high-density solution suitable for space-constrained PCBs using surface-mount assembly.
• Compliance and sourcing: RoHS-compliant device manufactured by AMD, facilitating lead-free production requirements.

Why Choose XC3S1000-4FGG676I?

The XC3S1000-4FGG676I combines a significant complement of logic elements, embedded memory, and a high I/O count in a compact 676-BGA package, making it well-suited for industrial applications that require configurable hardware functionality and reliable operation over a wide temperature range. Its core voltage range and package density accommodate modern board-level power and layout approaches.

This FPGA is an appropriate choice for engineering teams developing control systems, interface logic, and embedded processing solutions that benefit from on-device programmability and the backing of a recognized manufacturer.

Request a quote or submit a procurement inquiry for the XC3S1000-4FGG676I to receive pricing and availability information tailored to your project's needs.