XC3195-4PQ208C

FPGA, 484 CLBS, 6500 GATES
Part Description

XC3100 Field Programmable Gate Array (FPGA) IC 176 94944 208-BFQFP Exposed Pad

Quantity 409 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFP Exposed PadNumber of I/O176Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs484Number of Logic Elements/Cells484
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94944

Overview of XC3195-4PQ208C – XC3100 Field Programmable Gate Array (FPGA) IC 176 94944 208-BFQFP Exposed Pad

The XC3195-4PQ208C is a Field Programmable Gate Array (FPGA) IC from AMD designed for commercial embedded applications requiring programmable digital logic and substantial I/O. It combines on-chip logic, embedded memory, and a high I/O count in a 208-BFQFP exposed pad package.

With 484 logic elements, approximately 0.095 Mbits of embedded memory and 176 I/O pins, this device targets designs that need moderate logic density and flexible interfacing while operating from a 4.75 V to 5.25 V supply in commercial temperature environments.

Key Features

  • Core Logic  484 logic elements for implementing custom combinational and sequential digital functions.
  • Embedded Memory  Approximately 0.095 Mbits of on-chip RAM (94,944 bits) to support state, buffering and small-data storage requirements.
  • I/O Density  176 general-purpose I/O pins provide broad interfacing options for sensors, peripherals and system-level glue logic.
  • Power  Operates from a single 4.75 V to 5.25 V supply suitable for systems using standard 5 V logic domains.
  • Package  208-BFQFP exposed pad package (supplier device package: 208-PQFP, 28×28) optimized for surface-mount assembly and mechanical/thermal integration.
  • Mounting & Grade  Surface mount device; commercial grade with an operating temperature range of 0°C to 70°C.
  • Environmental Compliance  RoHS compliant for reduced hazardous substance content.

Typical Applications

  • Embedded Control and Glue Logic  Implement custom interface logic, state machines and protocol bridging within commercial embedded systems.
  • I/O Expansion and Interface Adaptation  Use the high pin count to adapt multiple peripherals and parallel interfaces to a host controller.
  • Prototyping and Development  Rapidly validate digital designs and system-level logic in a compact, surface-mount package.

Unique Advantages

  • Highly integrated solution: 484 logic elements and on-chip memory reduce the need for external glue logic and discrete components.
  • Generous I/O count: 176 I/O pins provide flexibility for complex interfacing without immediate need for I/O expanders.
  • Standard 5 V compatibility: Operates from 4.75 V to 5.25 V, facilitating integration into existing 5 V systems and boards.
  • Compact, surface-mount package: 208-PQFP (28×28) with exposed pad enables straightforward PCB assembly and mechanical attachment.
  • Commercial-grade and RoHS compliant: Rated for 0°C to 70°C operation and RoHS conformity to meet commercial product requirements.

Why Choose XC3195-4PQ208C?

The XC3195-4PQ208C delivers a balanced combination of programmable logic, embedded memory and a high I/O count in a commercial-grade, surface-mount package from AMD. It is suited to designers who need moderate logic density and flexible interfacing within 5 V system environments.

Backed by AMD’s XC3100-series FPGA offering, this device provides a practical option for commercial embedded designs, prototypes and I/O-centric applications where RoHS compliance and standard operating temperature support are important.

Request a quote or submit an inquiry to start a procurement discussion for the XC3195-4PQ208C, including pricing and lead-time information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up