XC3195-3PQ208C

The XC3195-3PQ208C is a Field Programmable Gate Array (FPGA) IC supplied in a 208-BFQFP exposed pad package (208-PQFP, 28×28). It provides 484 logic elements, approximately 0.095 Mbits of embedded RAM, and 176 user I/O pins, designed for commercial-grade electronic designs.

With a 4.75 V to 5.25 V supply range, surface-mount packaging, and a 0 °C to 70 °C operating temperature, this FPGA suits commercial embedded applications that require moderate logic density and significant I/O capacity while meeting RoHS compliance.

Key Features

• Logic Capacity 484 logic elements for implementing moderate-scale programmable logic functions and custom control logic.
• Embedded Memory Approximately 0.095 Mbits of on-chip RAM to support local data buffering, state storage, and small lookup tables.
• I/O Density 176 user I/O pins to support multiple parallel interfaces, sensor arrays, or peripheral connectivity in a single device.
• Power Operates from a 4.75 V to 5.25 V supply range, suitable for standard 5 V system rails.
• Package and Mounting 208-BFQFP exposed pad (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB layouts and thermal relief via the exposed pad.
• Commercial Temperature Grade Rated for 0 °C to 70 °C operation to meet typical commercial-environment requirements.
• Regulatory Compliance RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems — Implements custom control logic and I/O handling in commercial devices that operate within 0 °C to 70 °C and use 5 V supply rails.
• I/O Expansion and Interface Bridging — Provides up to 176 I/O pins for consolidating peripheral interfaces or expanding digital connectivity on space-constrained PCBs.
• Compact Surface-Mount Designs — The 208-BFQFP exposed pad package supports dense, surface-mount assemblies where board space and thermal management are considerations.
• Local Data Buffering — Approximately 0.095 Mbits of on-chip RAM enables small buffering and state storage for control and timing functions.

Unique Advantages

• Right-sized Logic Capacity: 484 logic elements provide a balanced resource set for moderate-complexity programmable logic without excessive overhead.
• High I/O Count: 176 I/O pins allow consolidation of multiple signals and interfaces into a single device, reducing routing complexity and PCB component count.
• Standard 5 V Compatibility: The 4.75 V to 5.25 V supply range integrates directly with common 5 V system rails for straightforward power design.
• Surface-Mount, Exposed-Pad Thermal Option: The 208-BFQFP exposed pad package supports improved thermal performance in compact board layouts.
• RoHS Compliant: Supports lead-free assembly processes and regulatory requirements for many commercial products.

Why Choose XC3195-3PQ208C?

The XC3195-3PQ208C positions itself as a commercial-grade, moderately provisioned FPGA for designers who need a blend of logic elements, on-chip RAM, and extensive I/O in a compact surface-mount package. Its 5 V supply compatibility and exposed-pad 208-BFQFP package make it suitable for embedded designs that prioritize integration and I/O consolidation within standard commercial temperature ranges.

This FPGA is appropriate for engineering teams building commercial embedded systems, interface concentrators, or compact control modules that benefit from a single-chip programmable solution with RoHS compliance and predictable supply and thermal characteristics.

Request a quote or contact sales to obtain pricing, availability, and additional procurement details for the XC3195-3PQ208C.