XC3195-3PG223C

The XC3195-3PG223C is a commercial-grade Field Programmable Gate Array (FPGA) supplied in a 223-CPGA package (47.24 × 47.24 mm). It provides 484 logic elements and approximately 0.095 Mbits of embedded RAM, with 176 general-purpose I/O pins, making it suitable for compact, I/O-dense custom logic implementations.

Designed for 5 V systems, the device operates from 4.75 V to 5.25 V and is specified for commercial ambient conditions (0 °C to 70 °C). The unit ships in a through-hole mounting package and is RoHS compliant.

Key Features

• Core Logic 484 logic elements for implementing custom combinational and sequential logic functions.
• Embedded Memory Approximately 0.095 Mbits of on-chip RAM for small data buffers, state storage, and control tables.
• I/O Capacity 176 I/O pins to support many external signals, parallel buses, and multiple peripheral connections.
• Power Supply Operates from a 4.75 V to 5.25 V supply, compatible with standard 5 V digital systems.
• Package & Mounting 223-CPGA package (47.24 × 47.24 mm) with through-hole mounting for robust board retention and ease of prototyping or repair.
• Operating Range Rated for commercial temperature use from 0 °C to 70 °C.
• Compliance RoHS compliant for regulatory alignment in commercial applications.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and glue functions in 5 V embedded platforms where commercial temperature range is acceptable.
• I/O-Intensive Interfaces — Serve as a hub for parallel buses, sensor arrays, or peripheral aggregation using the 176 available I/O pins.
• Prototyping and Development Boards — Through-hole package simplifies hardware prototyping, evaluation, and field-side replacement.
• Small-Scale Signal Processing — Use available logic elements and embedded RAM for compact signal control, preprocessing, and finite-state implementations.

Unique Advantages

• Balanced Logic and Memory: 484 logic elements paired with on-chip RAM enable compact implementations of control and buffering functions without external memory.
• High I/O Density: 176 I/O pins provide flexibility to connect multiple peripherals or implement wide parallel interfaces without external multiplexing.
• 5 V System Compatibility: Native operation at standard 5 V supply rails simplifies integration into legacy and common commercial designs.
• Through-Hole Packaging: 223-CPGA through-hole package (47.24 × 47.24 mm) offers mechanical robustness and serviceability for prototype and repair-friendly designs.
• Regulatory Readiness: RoHS compliance facilitates deployment in environments that require lead-free component usage.

Why Choose XC3195-3PG223C?

The XC3195-3PG223C targets commercial designs that require a modest amount of programmable logic, a significant number of I/O signals, and straightforward board-level integration via a through-hole 223-CPGA package. Its 5 V supply range and RoHS compliance make it a practical choice for established commercial product lines and development platforms.

Choose this FPGA when your design calls for compact embedded memory, flexible I/O routing, and a commercial-temperature-rated programmable device that is easy to prototype and maintain. The combination of logic capacity, I/O count, and package choices delivers a dependable building block for a range of commercial embedded applications.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the XC3195-3PG223C. Our team will respond with the details you need to move your design forward.