XC3190A-3PQ160C

The XC3190A-3PQ160C is a Field Programmable Gate Array (FPGA) IC from AMD designed for commercial electronic applications. It provides moderate logic capacity with integrated on-chip RAM and a high I/O count in a 160‑lead BQFP surface‑mount package.

This device is intended for designs that require customizable digital logic, I/O consolidation, and selectable supply operation within a 4.25 V to 5.25 V range while operating in a commercial temperature environment (0 °C to 85 °C).

Key Features

• Logic Capacity  320 logic elements and approximately 6,000 gates to implement custom combinational and sequential logic functions.
• Embedded Memory  Total on‑chip RAM of 64,160 bits (approximately 64 kbits) to support small data buffers and state storage.
• I/O Resources  138 user I/O pins, enabling broad peripheral interfacing and signal routing in a single device.
• Power  Operates from a 4.25 V to 5.25 V supply range to match legacy 5 V logic domains.
• Package and Mounting  160‑lead BQFP package (supplier device package 160‑PQFP, 28×28) in a surface‑mount form factor for PCB assembly efficiency.
• Temperature and Grade  Commercial grade operation with an ambient range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant to support environmental and regulatory requirements for lead‑free assembly.

Typical Applications

• Custom Digital Logic  Implement glue logic, state machines, and protocol translators where a moderate number of logic elements and gates are sufficient.
• I/O Consolidation  Aggregate and route multiple peripheral signals using the device's 138 I/O pins to simplify PCB routing and reduce discrete components.
• Embedded Control  Provide programmable control and sequencing functions in commercial electronic systems that operate within standard temperature and 5 V supply domains.

Unique Advantages

• Balanced Logic and Memory: Combines 320 logic elements with ~64 kbits of on‑chip RAM to support control logic plus modest data buffering in one device.
• High I/O Density: 138 I/O pins enable flexible peripheral connectivity without external I/O expanders, reducing BOM and board area.
• Standard 5 V Compatibility: Operates across a 4.25 V to 5.25 V supply window, easing integration into existing 5 V designs.
• Compact Surface‑Mount Package: 160‑lead BQFP (surface mount) offers a compact footprint suitable for commercial PCB assemblies.
• RoHS Compliant: Meets lead‑free assembly requirements for environmentally conscious production processes.

Why Choose XC3190A-3PQ160C?

The XC3190A-3PQ160C delivers a practical combination of logic resources, embedded memory, and a high I/O count in a 160‑lead surface‑mount package, making it well suited for commercial electronic designs that require customizable digital functionality and I/O consolidation. Its 4.25 V to 5.25 V supply compatibility and commercial temperature rating make it appropriate for standard‑environment systems and legacy 5 V domains.

Choose this FPGA when you need a moderate‑density, RoHS‑compliant programmable logic device that integrates logic, RAM, and comprehensive I/O in a single package to simplify design and reduce component count.

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