XC3190-PQ160IPH

The XC3190-PQ160IPH is an AMD XC3100-series Field Programmable Gate Array (FPGA) supplied in a 160-pin BQFP surface-mount package. The device provides a mid-density programmable logic solution with 320 logic elements, approximately 64,160 bits of on-chip RAM and 138 I/O pins.

Designed for industrial use, the part supports a 4.5 V to 5.5 V supply and an operating temperature range of −40 °C to 85 °C. It is RoHS compliant and packaged for PCB surface-mount assembly.

Key Features

• Core Logic  320 logic elements provide flexible, reconfigurable logic resources for mid-density designs.
• Embedded Memory  Approximately 64,160 bits of on-chip RAM to store state, buffers, and small data structures without external memory.
• I/O Density  138 general-purpose I/O pins enable extensive external interfacing and signal routing on a single device.
• Logic Gate Equivalent  Rated at 6,000 gates to quantify overall programmable logic capacity for partitioning functions.
• Power  Single-supply operation from 4.5 V to 5.5 V to match common legacy and industrial power rails.
• Package & Mounting  160-BQFP (160-PQFP, 28 × 28) surface-mount package for standard PCB assembly processes.
• Industrial Temperature Grade  Specified for −40 °C to 85 °C operation for use in industrial environments.
• Regulatory  RoHS compliant to support lead-free manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Field and machine-level control functions that benefit from the device’s industrial temperature range and 138 I/O pins for sensor and actuator interfaces.
• Embedded Logic and Glue  Replacement or consolidation of discrete logic and glue circuitry using 320 logic elements to implement control paths and timing logic.
• Custom I/O Management  I/O-rich designs requiring flexible pin assignments and on-chip buffering for peripheral aggregation or protocol conversion.

Unique Advantages

• Mid-density integration: 320 logic elements and 6,000-gate equivalence let you implement moderately complex functions without large FPGA overhead.
• On-chip RAM reduces external parts: Approximately 64,160 bits of embedded memory cut the need for some external SRAM or register banks, simplifying BOM and layout.
• High I/O count: 138 I/O pins support extensive external connectivity for signals, buses, and peripherals on a single device.
• Industrial readiness: Rated for −40 °C to 85 °C operation, suitable for many industrial environments where extended temperature range is required.
• 5 V supply compatibility: Operation from 4.5 V to 5.5 V aligns with legacy and industrial power systems, easing integration into existing designs.
• RoHS compliant: Meets lead-free manufacturing requirements for modern production processes.

Why Choose XC3190-PQ160IPH?

The XC3190-PQ160IPH delivers a balanced combination of logic capacity, on-chip memory and I/O density in a compact 160-BQFP surface-mount package from AMD. Its industrial temperature rating and 5 V supply range make it a practical choice for embedded systems that require reliable operation across a broad temperature range.

This device is well suited to engineering teams seeking a mid-density FPGA to consolidate glue logic, manage custom I/O, or implement control functions while reducing external component count. RoHS compliance and a standardized package help simplify manufacturing and assembly planning.

Request a quote to check pricing and availability or to submit procurement details for the XC3190-PQ160IPH.