XC3190-PG175CPH

The XC3190-PG175CPH is a Field Programmable Gate Array (FPGA) IC from AMD presented in a 175-BCPGA through-hole package. It provides a compact set of on-chip resources including 320 logic elements, approximately 64 kbits of embedded RAM, and 144 user I/O pins, making it suitable for compact digital logic implementations and board-level designs that require a moderate amount of programmable logic.

Designed for commercial applications, the device operates from a 4.75 V to 5.25 V supply and across a 0 °C to 70 °C temperature range, with RoHS compliance for environmental compatibility.

Key Features

• Logic Resources 320 logic elements (320 logic cells) and an estimated 6,000 equivalent gates provide the programmable logic capacity for small to medium complexity designs.
• On-chip Memory Approximately 64 kbits of embedded RAM (64,160 bits) for implementing small buffers, state machines, and lookup tables directly on-chip.
• I/O Density 144 user I/O pins enable flexible interfacing to peripherals, sensors, and external logic at the board level.
• Package and Mounting 175-BCPGA (supplier package: 175-CPGA, 42.16 × 42.16 mm) in a through-hole format for ease of board-level handling and assembly.
• Power Single supply operation from 4.75 V to 5.25 V, suitable for legacy 5 V systems and designs that require this supply domain.
• Operational Grade and Compliance Commercial grade device rated for 0 °C to 70 °C operation and RoHS compliant for environmental standards.
• Manufacturer Produced by AMD, offering support through the vendor’s product documentation and lifecycle.

Typical Applications

• Glue Logic and Interface Bridging Use the 320 logic elements and 144 I/O to implement board-level glue logic, protocol bridging, or custom signal routing between subsystems.
• Control and Sequencing The embedded RAM and logic resources support small state machines and control logic for equipment control or peripheral management.
• Prototyping and Evaluation Through-hole 175-BCPGA packaging and accessible I/O make the part suitable for prototyping and iterative development on evaluation boards.

Unique Advantages

• Balanced Logic and Memory: A combination of 320 logic elements and ~64 kbits of on-chip RAM enables compact implementations without external memory for many control and glue tasks.
• High I/O Count: 144 I/O pins allow direct connection to multiple peripherals and interfaces, reducing the need for external I/O expanders.
• Through-Hole Package for Ease of Use: The 175-BCPGA through-hole package simplifies handling and board assembly for laboratory and prototyping environments.
• 5 V Supply Compatibility: Operates from 4.75 V to 5.25 V, fitting designs that rely on traditional 5 V power rails.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly processes.

Why Choose XC3190-PG175CPH?

The XC3190-PG175CPH positions itself as a compact, commercially graded FPGA option that brings together a practical mix of logic, memory, and I/O for board-level digital designs. Its through-hole 175-BCPGA package, 144 I/O pins, and on-chip RAM make it a straightforward choice for designers needing moderate programmable logic capacity without external memory dependencies.

This part is well suited to engineers and procurement teams working on control, interfacing, and prototyping projects who require a commercially rated FPGA with clear supply and temperature specifications and RoHS compliance.

Request a quote or submit an inquiry to purchase the XC3190-PG175CPH and receive pricing and availability information tailored to your project requirements.