XC3190-5PQ208I

The XC3190-5PQ208I is a field programmable gate array (FPGA) IC in a 208-BFQFP exposed pad package designed for surface-mount assembly. It provides moderate programmable logic capacity with 320 logic elements, approximately 64,160 bits of on-chip RAM, and a high I/O count suitable for embedded and industrial designs.

With a 4.5 V to 5.5 V supply range and industrial operating temperature from -40 °C to 85 °C, this device is targeted at applications that require reliable, configurable logic and broad interfacing capabilities in a compact package.

Key Features

• Programmable Logic  320 logic elements delivering a logic capacity equivalent to 6,000 gates, enabling implementation of custom glue logic and moderate combinational/sequential functions.
• Embedded Memory  Total on-chip RAM of 64,160 bits (approximately 0.064 Mbits) for state storage, buffers, and small data structures within user logic.
• I/O Density  144 general-purpose I/O pins to support multiple peripheral connections and parallel interfaces without external I/O expanders.
• Power  Operates from a 4.5 V to 5.5 V power supply, simplifying compatibility with 5 V systems and common industrial power rails.
• Package & Mounting  208-BFQFP exposed pad (208-PQFP, 28 × 28 mm) surface-mount package that facilitates PCB assembly and thermal conduction through the exposed pad.
• Operating Range  Industrial-grade device rated for -40 °C to 85 °C, suitable for deployments in extended-temperature environments.
• Surface-Mount Form Factor  Designed for standard surface-mount production processes to support compact PCB layouts and automated assembly.

Typical Applications

• Industrial Control  Implement control logic, timing, and interfacing functions where industrial temperature performance and a robust I/O complement are required.
• Embedded Prototyping  Develop and iterate custom logic functions or small-scale FPGA designs that need on-chip RAM and moderate logic capacity for proof-of-concept and production runs.
• I/O Expansion and Interface Bridging  Consolidate multiple peripheral interfaces or act as an interface bridge in systems that require a high number of general-purpose I/Os.
• Custom Logic for Commercial Equipment  Integrate application-specific combinational and sequential logic into devices operating on 5 V rails where compact packaging and surface-mount assembly are priorities.

Unique Advantages

• High I/O Count:  144 I/O pins allow extensive peripheral connectivity directly from the FPGA, reducing the need for external I/O hardware.
• Balanced Logic and Memory Resources:  320 logic elements paired with ~64,160 bits of on-chip RAM provide a practical balance for moderate-density designs that need local data storage.
• Industrial Temperature Rating:  Rated for -40 °C to 85 °C, enabling deployment in environments with extended temperature requirements.
• Exposed Pad BFQFP Package:  208-BFQFP with exposed pad supports effective PCB-level thermal management and compact board integration.
• 5 V Power Compatibility:  4.5 V to 5.5 V supply range aligns with standard 5 V systems common in industrial and legacy equipment.
• Surface-Mount Ready:  Surface-mount package simplifies automated assembly and helps maintain a small PCB footprint.

Why Choose XC3190-5PQ208I?

The XC3190-5PQ208I positions itself as a practical FPGA choice for engineers needing a moderate amount of programmable logic, significant I/O capacity, and embedded RAM in a single surface-mount package. Its industrial temperature rating and 5 V supply compatibility make it suitable for a range of embedded and industrial applications where reliability and interface density matter.

This device is appropriate for designs requiring compact, configurable logic blocks and on-chip memory while maintaining robust environmental performance and a package that supports production-friendly assembly.

Request a quote or submit an inquiry to purchase XC3190-5PQ208I and evaluate how its logic density, I/O count, and industrial-grade specifications fit your next design.