XC3190-5PP175C

The XC3190-5PP175C is an XC3100 series Field Programmable Gate Array (FPGA) from AMD, offering programmable digital logic in a commercial-grade device. It provides 320 logic elements, approximately 64,160 bits of on-chip RAM, and 144 user I/O in a 175-BPGA package, supporting designs that require moderate logic capacity and flexible I/O integration.

Key Features

• Configurable logic 320 logic elements (320 logic cells) for implementing custom digital functions and moderate logic integration.
• Embedded memory Total on-chip RAM of 64,160 bits for small buffers, state storage, and local data handling.
• I/O density 144 user I/O pins to support multiple peripheral interfaces and parallel signal routing.
• Logic capacity Equivalent to 6,000 gates, providing capacity for glue logic, control functions, and moderate combinational/sequential designs.
• Power Standard 5 V supply operation with a specified range of 4.75 V to 5.25 V for straightforward integration into 5 V systems.
• Package and mounting 175-BPGA / supplier device package 175-PGA (42.16 × 42.16 mm) with through-hole mounting for board-level assembly and prototyping flexibility.
• Operating conditions Commercial-grade device specified for 0 °C to 70 °C operating temperature.
• Compliance RoHS compliant.

Typical Applications

• Custom digital logic Implement glue logic, protocol decoding, and compact state machines using the device’s programmable resources.
• Prototyping and development Through-hole 175-BPGA package and standard 5 V supply make the device suitable for board-level prototyping and evaluation.
• I/O expansion and interfacing Use the 144 I/O pins to interface with multiple peripherals, sensors, and external logic devices.
• Control and sequencing Leverage the on-chip RAM and logic elements for moderate control, timing, and sequencing tasks in commercial electronics.

Unique Advantages

• Balanced logic and memory 320 logic elements combined with 64,160 bits of RAM deliver a practical mix of logic and embedded storage for mid-range designs.
• High I/O count 144 I/O pins reduce the need for external I/O expanders and simplify board-level signal routing.
• 5 V system compatibility Operation across 4.75 V to 5.25 V eases integration into existing 5 V power architectures.
• Through-hole package for assembly flexibility 175-BPGA through-hole mounting supports robust board attachment and convenient prototyping workflows.
• Commercial-grade specification Specified for 0 °C to 70 °C operation and RoHS compliance for standard commercial applications.

Why Choose XC3190-5PP175C?

The XC3190-5PP175C positions itself as a practical FPGA choice for commercial applications that need moderate programmable logic, substantial I/O, and embedded RAM in a through-hole 175-BPGA package. Its 320 logic elements, approximately 64,160 bits of on-chip memory, and 144 I/O pins make it well suited to designers implementing custom digital functions, interface logic, and prototype systems that operate on standard 5 V supplies.

Manufactured by AMD and supplied in a common 175-PGA footprint, this device provides a clear, verifiable specification set for procurement and system integration where commercial-grade performance and RoHS compliance are required.

Request a quote today to check pricing and availability for the XC3190-5PP175C and to obtain ordering information.