XC3190-4PQ208C

The XC3190-4PQ208C is a commercial-grade FPGA from AMD designed for low- to mid-density programmable logic tasks. It integrates 320 logic elements, roughly 64.16 kbits of on-chip RAM, and 144 general-purpose I/O pins in a 208-pin BFQFP exposed-pad surface-mount package.

This device is targeted at designers and OEMs building compact, board-level programmable logic solutions for commercial electronics, prototyping, and embedded control where a moderate logic capacity and high I/O count are required. The 4.75 V to 5.25 V supply range and RoHS compliance make it suitable for mainstream commercial applications with standard 5 V systems.

Key Features

• Logic Capacity — 320 logic elements (cells) providing discrete programmable logic resources suitable for glue logic, state machines, and modest combinational/sequential functions.
• Embedded Memory — Total on-chip RAM of 64,160 bits (approximately 64.16 kbits) for local buffers, FIFOs, and small datapath storage.
• I/O Density — 144 user I/O pins to support multiple parallel interfaces, bus connections, and peripheral interfacing on a single device.
• Gate Count — Approximately 6,000 gates for mapping moderate digital logic and control functions.
• Package and Mounting — 208-BFQFP with exposed pad (supplier package: 208-PQFP, 28×28) in a surface-mount configuration for compact PCB layouts and thermal grounding.
• Power Supply — Operates from a 4.75 V to 5.25 V supply, aligning with standard 5 V digital system rails.
• Commercial Temperature Range — Rated for 0 °C to 70 °C operation for commercial applications.
• Standards Compliance — RoHS compliant for regulatory and environmental requirements.

Typical Applications

• Consumer Electronics — Implement control logic and peripheral interfaces in consumer devices where a commercial-grade FPGA and abundant I/O are needed.
• Embedded Control — Implement state machines, glue logic, and small datapath functions for embedded controllers operating on 5 V systems.
• Prototyping and Development — Rapid hardware prototyping and proof-of-concept designs that require reprogrammable logic and flexible I/O pinouts.
• Interface Bridging — Serve as an I/O-expander or protocol adapter between multiple parallel interfaces and microcontroller or ASIC front ends.

Unique Advantages

• Balanced Logic and Memory — The combination of 320 logic elements and ~64.16 kbits of embedded RAM supports mixed control and buffered data tasks without external memory for many applications.
• High I/O Count — 144 I/O pins enable consolidation of multiple signals and buses, reducing component count and PCB routing complexity.
• Standard 5 V Compatibility — Native operation from 4.75 V to 5.25 V supplies simplifies integration into existing 5 V digital platforms.
• Compact Surface-Mount Package — 208-BFQFP with exposed pad allows dense PCB placement and an exposed pad option for thermal and ground management.
• Commercial-Ready — Designed for commercial temperature operation (0 °C to 70 °C) and RoHS compliance for widespread product deployment.

Why Choose XC3190-4PQ208C?

The XC3190-4PQ208C delivers a practical mix of programmable logic, embedded memory, and a generous I/O complement in a single, surface-mount package from AMD. Its specifications make it a suitable choice for designers needing a reconfigurable solution for commercial electronics, embedded control, or prototype development where 5 V system compatibility and moderate logic density are required.

Choosing this AMD FPGA provides a compact, RoHS-compliant option for consolidating control logic and interface functions, helping to reduce BOM complexity and accelerate time-to-market for commercial applications.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3190-4PQ208C and to discuss how this FPGA can fit into your next design.