XC3190-4PP175C
| Part Description |
XC3100 Field Programmable Gate Array (FPGA) IC 144 64160 175-BPGA |
|---|---|
| Quantity | 320 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 175-PGA (42.16x42.16) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 175-BPGA | Number of I/O | 144 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Through Hole | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 320 | Number of Logic Elements/Cells | 320 | ||
| Number of Gates | 6000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 64160 |
Overview of XC3190-4PP175C – XC3100 Field Programmable Gate Array (FPGA) IC 144 64160 175-BPGA
The XC3190-4PP175C is a commercial-grade field programmable gate array (FPGA) in a 175-BPGA package designed for general-purpose digital logic integration. It provides a compact programmable fabric with 320 logic elements and 144 I/O pins, suitable for control, interfacing, and glue-logic tasks in commercial electronic systems.
With on-chip embedded memory and a standard 5 V supply range, this device targets designers who need a through-hole FPGA solution that balances integration and simplicity for commercial applications.
Key Features
- Core Logic 320 logic elements enabling implementation of custom combinational and sequential logic functions.
- Embedded Memory Approximately 0.064 Mbits (64,160 bits) of on-chip RAM to support small buffers, state storage, and lookup tables.
- I/O Resources 144 input/output pins for flexible interfacing with peripherals, sensors, and external logic.
- Gate Capacity Approximately 6,000 gates of logic capacity for moderate-complexity designs and glue logic integration.
- Power Standard 4.75 V to 5.25 V voltage supply simplifies integration into 5 V commercial systems.
- Package & Mounting 175-BPGA package (supplier device package listed as 175-PGA, 42.16 × 42.16 mm) with through-hole mounting for robust board assembly.
- Operating Range Commercial temperature grade with an operating range of 0 °C to 70 °C.
- Compliance RoHS compliant for environmental regulatory alignment.
Typical Applications
- Commercial Control Systems Implement custom control logic and sequencers where moderate logic density and multiple I/Os are required.
- Peripheral and Interface Bridging Act as glue logic between subsystems, translating or buffering signals across multiple interfaces using its 144 I/Os.
- Prototyping and Educational Projects Suitable for proof-of-concept and learning environments that require a through-hole FPGA solution with accessible I/O.
- Embedded Buffering and Lookup Use the on-chip RAM for small FIFOs, lookup tables, and temporary data storage in commercial electronic products.
Unique Advantages
- Compact Programmable Logic: 320 logic elements provide a concise platform for implementing custom digital functions without excessive board-level components.
- Generous I/O Count: 144 I/Os enable direct interface to a wide range of peripherals, reducing the need for external I/O expanders.
- Through-Hole Mounting: The through-hole 175-BPGA package offers mechanical robustness and straightforward assembly for certain commercial boards and retrofit applications.
- Standard 5 V Supply: Operates from 4.75 V to 5.25 V, easing integration into existing 5 V system architectures.
- RoHS Compliant: Meets common environmental requirements, simplifying product compliance considerations.
- Commercial Temperature Rating: Designed for reliable operation across typical commercial temperature ranges (0 °C to 70 °C).
Why Choose XC3190-4PP175C?
The XC3190-4PP175C positions itself as a practical, commercial-grade FPGA for designers who need moderate logic capacity, substantial I/O, and embedded memory in a through-hole BPGA package. Its combination of approximately 320 logic elements, 144 I/Os, and on-chip RAM supports implementations ranging from interface bridging to embedded control logic without excessive external components.
This part is well suited to engineering teams and procurement groups building commercial electronic equipment or prototypes that require a straightforward 5 V FPGA solution with RoHS compliance and a clearly defined operating temperature range.
Request a quote or submit an inquiry to receive pricing and availability for the XC3190-4PP175C and to discuss how it can fit into your next commercial design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








