XC3164A-3TQ144C
| Part Description |
XC3000A/L Field Programmable Gate Array (FPGA) IC 120 46064 144-LQFP |
|---|---|
| Quantity | 254 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 120 | Voltage | 4.25 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 224 | Number of Logic Elements/Cells | 224 | ||
| Number of Gates | 4500 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46064 |
Overview of XC3164A-3TQ144C – XC3000A/L Field Programmable Gate Array (FPGA) IC, 120 I/O, 46,064-bit RAM, 144-LQFP
The XC3164A-3TQ144C is a Field Programmable Gate Array (FPGA) from the XC3000A/L family, provided in a 144-pin low-profile quad flat package. It delivers a compact, surface-mount programmable logic solution with 224 logic elements and integrated on-chip RAM, designed for commercial-grade electronic designs.
Key attributes include 120 I/O pins, approximately 46,064 bits of embedded memory, support for a 4.25 V to 5.25 V supply, and operation across a 0 °C to 85 °C commercial temperature range—making it suitable for a range of general-purpose embedded and logic-intensive applications.
Key Features
- Core Logic 224 logic elements (LEs) providing programmable logic resources and an estimated 4,500 equivalent gates for implementing custom digital functions.
- Embedded Memory Total on-chip RAM of 46,064 bits (approximately 0.046 Mbits) for local data storage and buffering within designs.
- I/O Capability 120 general-purpose I/O pins to support multiple external interfaces and peripherals.
- Power Supply Single-supply operation across a 4.25 V to 5.25 V range to match standard commercial logic domains.
- Package and Mounting 144-LQFP package (supplier device package: 144-TQFP, 20×20) in a surface-mount form factor for PCB-level integration.
- Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory RoHS-compliant construction for adherence to common environmental requirements.
Unique Advantages
- Compact programmable logic: 224 logic elements enable implementation of custom digital functions in a small package footprint, reducing board area.
- On-chip storage: 46,064 bits of embedded RAM reduce dependence on external memory for many control and buffering tasks.
- Generous I/O count: 120 I/O pins provide flexibility to interface with sensors, peripherals, and external logic without immediate need for I/O expanders.
- Standard 5 V supply: Supports a 4.25 V to 5.25 V supply window, simplifying power-rail design where standard logic voltages are used.
- Surface-mount 144-LQFP packaging: Industry-standard package (144-TQFP, 20×20) streamlines PCB layout and assembly processes.
- Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliance for typical commercial electronic products.
Why Choose XC3164A-3TQ144C?
The XC3164A-3TQ144C positions itself as a practical, commercially graded FPGA option for engineers seeking a balance of programmable logic, embedded memory, and I/O density in a standardized surface-mount package. Its specification set—224 logic elements, roughly 46,064 bits of on-chip RAM, 120 I/O pins, and a 144-LQFP footprint—helps streamline design decisions for compact embedded systems and control applications that operate within a 0 °C to 85 °C temperature window and standard 5 V power rails.
This device is well suited to teams and projects that require a proven, RoHS-compliant programmable logic element with clear, verifiable electrical and thermal limits. Its combination of logic resources, memory, and I/O simplifies integration and supports reliable, repeatable designs while keeping board-level complexity manageable.
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