XC3190-3PP175C

The XC3190-3PP175C is a commercial-grade Field Programmable Gate Array (FPGA) from AMD, providing 320 logic elements and 64,160 bits of on-chip RAM. Designed for general-purpose embedded and control applications, it offers a balance of logic capacity, I/O density and a 5 V-compatible supply for legacy and mixed-voltage systems.

With 144 I/O pins, a 175-BPGA package option and through-hole mounting, this device is suited to applications that require a moderate logic count, on-chip memory and a well-defined commercial operating range.

Key Features

• Core Logic  320 logic elements provide programmable combinatorial and sequential resources for glue-logic, state machines and control functions.
• Embedded Memory  64,160 bits of on-chip RAM (approximately 0.064 Mbits) supports data buffering and small lookup tables without external memory.
• I/O Density  144 I/O pins allow for substantial peripheral interfacing including sensors, displays and external controllers.
• Package & Mounting  Available in a 175-BPGA (supplier package: 175-PGA, 42.16 × 42.16 mm) with through-hole mounting, simplifying board handling and prototyping.
• Power  Operates from a 4.75 V to 5.25 V supply range compatible with standard 5 V logic environments.
• Operating Range & Compliance  Commercial-grade device specified for 0 °C to 70 °C operation and compliant with RoHS environmental requirements.
• Logic Scale  Equivalent to approximately 6,000 gates for implementing a range of medium-complexity digital functions.

Typical Applications

• Embedded Control  Implement control logic, finite state machines and timing-critical glue between peripherals in commercial embedded systems.
• Sensor and Interface Aggregation  Aggregate and preprocess signals from multiple sensors or interfaces using available I/O and on-chip RAM for temporary buffering.
• User Interface Control  Drive and manage buttons, indicators and simple displays where moderate logic and I/O density are required.
• Prototyping and Education  Provide a through-hole, easy-to-handle package for prototyping, development boards and instructional laboratories.

Unique Advantages

• Balanced Logic and Memory: 320 logic elements paired with 64,160 bits of RAM let designers implement compact processing blocks and local buffers without external memory.
• High I/O Count: 144 I/O pins enable versatile interfacing options, reducing the need for external I/O expanders in many designs.
• 5 V-Compatible Power Range: Native operation from 4.75 V to 5.25 V simplifies integration into existing 5 V systems and legacy environments.
• Through-Hole Package for Ease of Use: 175-BPGA / 175-PGA (42.16 × 42.16 mm) with through-hole mounting supports easier assembly and replacement in lab and prototyping contexts.
• Commercial Temperature and RoHS Compliance: Specified 0 °C to 70 °C operation and RoHS compliance meet standard commercial product and regulatory expectations.

Why Choose XC3190-3PP175C?

The XC3190-3PP175C positions itself as a practical FPGA choice for commercial embedded designs that require a moderate number of logic elements, substantial I/O, and on-chip RAM in a through-hole, 175-pin package. Its 5 V-compatible supply and RoHS compliance make it straightforward to integrate into existing commercial systems and development platforms.

This device is best suited for designers and teams working on control, interfacing and prototyping projects who need predictable commercial-grade performance, a clear pinout and a balance of logic and memory resources from a reputable manufacturer.

Request a quote or submit an inquiry for the XC3190-3PP175C to receive pricing and availability details for your next design.