XC3190-3PQ208C

The XC3190-3PQ208C is a commercial-grade Field Programmable Gate Array (FPGA) supplied in a 208‑lead BFQFP package with an exposed pad. It provides 320 logic elements, roughly 6,000 gates and 64,160 bits of on-chip RAM, making it suitable for designs that require modest programmable logic and embedded memory within a surface-mount footprint.

Designed for 5 V systems, the device operates from 4.75 V to 5.25 V and supports an ambient operating temperature range of 0 °C to 70 °C. The package includes 144 user I/O pins and an exposed-pad thermal option for board-level thermal management.

Key Features

• Core Logic  320 logic elements (equivalent logic cells) and approximately 6,000 gates for implementing combinational and sequential logic.
• On-chip Memory  Total RAM of 64,160 bits provides embedded memory for buffering, small lookup tables, and state storage.
• I/O Capacity  144 user I/O pins allow connectivity to multiple peripherals and system interfaces across a single device.
• Power Supply  Designed for 5 V systems with a specified supply range of 4.75 V to 5.25 V to match legacy and standard logic rails.
• Package and Mounting  208‑lead BFQFP with exposed pad (supplier package: 208‑PQFP, 28 × 28 mm) in a surface-mount configuration for compact PCB integration.
• Operating Range  Commercial-grade device with an operating temperature range of 0 °C to 70 °C.
• Compliance  RoHS‑compliant for environmental and regulatory considerations.

Typical Applications

• General-purpose digital logic  Implement glue logic, state machines, and protocol translation using the device's 320 logic elements and on-chip RAM.
• Embedded control and interfacing  Leverage 144 I/O pins for sensor interfacing, peripheral control, and board-level interconnect tasks.
• Prototype and proof-of-concept designs  Use the programmable fabric and integrated memory to validate custom digital functions before ASIC implementation.

Unique Advantages

• Compact, exposed-pad PQFP package: Enables surface-mount placement with an exposed pad for improved board-level thermal conduction and dense PCB layouts.
• Balanced logic and memory: 320 logic elements paired with 64,160 bits of RAM provide a practical combination for moderate-complexity digital functions without excessive BOM cost.
• High I/O count: 144 user I/O pins simplify system-level interfacing and reduce the need for external I/O expanders.
• 5 V supply compatibility: Native support for a 4.75 V to 5.25 V supply range makes integration straightforward in legacy 5 V systems.
• RoHS compliance: Meets environmental requirements for lead‑free assembly and global compliance needs.

Why Choose XC3190-3PQ208C?

The XC3190-3PQ208C positions itself as a practical commercial-grade FPGA option for designs requiring a modest amount of programmable logic, embedded RAM, and a high I/O count in a compact surface-mount package. Its 208‑lead BFQFP exposed-pad form factor and 5 V supply compatibility make it a straightforward choice for retrofit, prototyping, and general-purpose digital control applications.

Engineers and purchasers looking for a RoHS-compliant FPGA with clear operational parameters—320 logic elements, 64,160 bits of RAM, 144 I/O, and a 0 °C to 70 °C operating range—will find this device appropriate for deployments where those specific characteristics match the system requirements.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the XC3190-3PQ208C. A sales request will help you secure component details and ordering options tailored to your project timeline.