XC3190-4PP175I

The XC3190-4PP175I is a field programmable gate array (FPGA) in the XC3000 family, offering a compact logic fabric and embedded memory in a 175-PGA package. It provides 320 logic elements, approximately 64,160 bits (≈0.064 Mbits) of embedded RAM, and 144 general-purpose I/O pins, making it suitable for designs that require moderate programmable logic and flexible I/O in a through-hole package.

This device operates from a 4.5 V to 5.5 V supply and is rated for industrial temperature operation from -40 °C to 100 °C, enabling deployment in temperature-sensitive environments that require robust component-level performance.

Key Features

• Core Logic — 320 logic elements providing the programmable building blocks for implementing custom digital functions; overall gate count listed as 6,000.
• Embedded Memory — Total RAM of 64,160 bits (approximately 0.064 Mbits) for local buffering, state storage, and small lookup tables.
• I/O Density — 144 user-accessible I/O pins to support multiple peripheral interfaces and external device connections.
• Power — Single-supply operation from 4.5 V to 5.5 V to align with standard 5 V systems and legacy logic environments.
• Package & Mounting — 175-BPGA / 175-PGA (42.16 × 42.16 mm) package supplied for through-hole mounting, simplifying integration into existing board layouts that require this form factor.
• Temperature & Grade — Industrial grade with operating range from -40 °C to 100 °C for reliable performance across a broad thermal span.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• Compact programmable logic: 320 logic elements and a 6,000-gate equivalent provide sufficient density for control, glue logic, and medium-complexity custom functions without excessive board-level components.
• On-board memory for logic tasks: Approximately 0.064 Mbits of embedded RAM supports buffering and small memory-based functions without external memory.
• High I/O count: 144 I/O pins enable flexible interfacing to a variety of external devices and parallel buses.
• Standard 5 V compatibility: 4.5 V to 5.5 V supply range allows straightforward use in established 5 V systems and legacy platforms.
• Through-hole 175-PGA package: The 175-PGA footprint facilitates integration in designs that require through-hole mounting or compatibility with existing mechanical/assembly constraints.
• Industrial temperature rating: -40 °C to 100 °C operation supports deployment in environments with wide temperature swings.

Why Choose XC3190-4PP175I?

The XC3190-4PP175I positions itself as a practical FPGA choice where a balance of programmable logic, embedded RAM, and extensive I/O is required in a through-hole 175-PGA package. Its industrial temperature rating and standard 5 V supply make it suitable for designs that need reliable operation across a wide thermal range and compatibility with legacy power domains.

Choose this device for mid-density logic integration when you need on-chip memory for buffering or lookup tasks, a high number of I/Os for peripheral interfacing, and a package style that fits existing board layouts. The RoHS compliance and defined specifications provide predictable behavior for procurement and engineering planning.

Request a quote or submit a purchase inquiry to get pricing and availability for the XC3190-4PP175I. Our team will assist with lead times and order details to support your design schedule.