XC3164-PP132CPH

XC3164 - XC3000 SERIES FIELD PRO
Part Description

XC3100 Field Programmable Gate Array (FPGA) IC 110 46064 224 132-BPGA

Quantity 1,889 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package132-PGA (37.08x37.08)GradeCommercialOperating Temperature0°C – 70°C
Package / Case132-BPGANumber of I/O110Voltage4.25 V - 5.25 V
Mounting MethodThrough HoleRoHS ComplianceUnknownREACH ComplianceREACH Affected
Moisture Sensitivity LevelVendor UndefinedNumber of LABs/CLBs224Number of Logic Elements/Cells224
Number of Gates4500ECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46064

Overview of XC3164-PP132CPH – XC3100 FPGA, 224 logic elements, 110 I/O, 132-BPGA

The XC3164-PP132CPH is an AMD XC3100 Field Programmable Gate Array (FPGA) IC in a 132-BPGA package. It delivers a compact, reprogrammable logic fabric with 224 logic elements, approximately 46 kbits of on-chip RAM, and 110 general-purpose I/O pins for customizable digital designs.

Designed for commercial applications, this FPGA supports a 4.25 V to 5.25 V supply range and operates across a 0 °C to 70 °C temperature window, making it suitable for a variety of standard embedded and prototype systems.

Key Features

  • Configurable Logic Capacity 224 logic elements for implementing custom combinational and sequential logic functions.
  • Embedded Memory Approximately 46 kbits (46,064 bits) of on-chip RAM for small data buffers, lookup tables, and state storage.
  • I/O Resources 110 I/O pins to interface with peripherals, sensors, and external logic devices.
  • Gate Equivalent Approximately 4,500 gates to support low- to mid-complexity digital functions.
  • Package and Mounting 132-BPGA (132-PGA, 37.08 × 37.08 mm) package with through-hole mounting for robust board attachment and straightforward prototyping.
  • Power and Temperature Operates from 4.25 V to 5.25 V and rated for commercial temperature operation from 0 °C to 70 °C.
  • Regulatory RoHS compliant.

Typical Applications

  • Prototyping and Development — Use the FPGA’s reprogrammable logic and accessible 132-BPGA package for board-level prototyping and iterative algorithm development.
  • Embedded Control — Implement control logic, state machines, and peripheral interfacing in commercial embedded systems within the 0 °C to 70 °C operating range.
  • I/O Expansion and Glue Logic — Leverage 110 I/O pins to consolidate interface circuitry and translate signals between subsystems.
  • Small-Scale DSP and Data Handling — Utilize the on-chip RAM and logic elements for compact buffering, data formatting, and simple signal-processing tasks.

Unique Advantages

  • Compact, Reprogrammable Logic: 224 logic elements provide a flexible platform for implementing custom functionality without committing to fixed silicon.
  • Significant I/O Density: 110 I/O pins reduce the need for external I/O expanders and simplify board-level connectivity.
  • On-Chip Memory: Approximately 46 kbits of embedded RAM enable local buffering and table storage, reducing external memory requirements.
  • Standard 5 V Supply Compatibility: Operates across a 4.25 V to 5.25 V range, aligning with common commercial power rails.
  • Through-Hole 132-BPGA Package: Robust mounting suited for prototyping and designs that benefit from secure board attachment.
  • RoHS Compliant: Meets RoHS requirements for lead-free assembly and regulatory compatibility in commercial products.

Why Choose XC3164-PP132CPH?

The XC3164-PP132CPH balances a practical logic capacity with substantial I/O and embedded memory in a through-hole 132-BPGA package, making it well suited for commercial embedded designs, prototyping, and applications requiring reprogrammable logic with moderate resource needs. Its 4.25 V to 5.25 V supply range and commercial temperature rating support straightforward integration into standard electronic systems.

For teams seeking a configurable solution that simplifies board-level interfacing and reduces external component count, the XC3164-PP132CPH provides verifiable on-chip resources and packaging that support reliable assembly and development workflows.

Request a quote or submit an inquiry to get pricing and availability for the XC3164-PP132CPH. Our team can provide lead-time information and assist with procurement for your project needs.

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