XC3164-5PQ160C0304

The XC3164-5PQ160C0304 is a field programmable gate array (FPGA) from AMD designed for commercial applications requiring on-chip programmable logic and I/O. It provides 224 logic elements, approximately 46,064 bits of embedded RAM, and up to 120 I/O pins in a 160‑BQFP surface-mount package.

With a single-supply operating range of 4.25 V to 5.25 V and a commercial temperature rating of 0 °C to 70 °C, this device is suited to embedded designs that need configurable logic resources and moderate on-chip memory in a compact package.

Key Features

• Logic Capacity — 224 logic elements (224 logic cells), enabling implementation of custom combinational and small-scale sequential logic functions.
• Embedded Memory — Approximately 46,064 bits of on-chip RAM to support small buffers, state storage, and localized data processing.
• I/O and Gate Count — 120 general-purpose I/O pins and a gate-equivalent count of 4,500 to accommodate signal interfacing and glue-logic tasks.
• Package and Mounting — 160‑BQFP (supplier device package: 160‑PQFP 28×28) in a surface-mount form factor for PCB space-efficient designs.
• Power and Temperature — Operates from 4.25 V to 5.25 V and rated for commercial use between 0 °C and 70 °C.
• Compliance — RoHS‑compliant construction for environmental regulatory adherence.

Typical Applications

• Embedded Control Logic — Programmable logic and I/O capacity suitable for implementing control functions and custom state machines within embedded systems.
• Prototyping and Development — On-chip resources and a standard BQFP package make the device appropriate for prototype boards and early design validation where configurable logic is needed.
• Glue Logic and Signal Conditioning — Use as configurable glue logic to integrate and interface between discrete digital components, leveraging 120 I/O pins.

Unique Advantages

• Balanced Logic and Memory: Combines 224 logic elements with ~46,064 bits of embedded RAM, allowing localized data storage alongside programmable logic.
• Generous I/O Count: 120 I/O pins provide flexibility for interfacing multiple peripherals or signals without external expander hardware.
• Standard Surface‑Mount Package: 160‑BQFP (28×28 PQFP footprint) supports compact PCB layouts while remaining compatible with common assembly processes.
• Commercial Temperature Rating: Designed for 0 °C to 70 °C operation, matching typical commercial electronics deployment conditions.
• RoHS‑Compliant: Environmentally compliant materials facilitate integration into products with regulatory requirements for lead‑free components.

Why Choose XC3164-5PQ160C0304?

The XC3164-5PQ160C0304 positions itself as a compact, commercial-grade FPGA option for designs that require a moderate amount of programmable logic, on-chip RAM, and a high I/O count in a 160‑BQFP surface-mount package. Its supply voltage range and RoHS compliance make it suitable for standard commercial electronics manufacturing.

This device is a practical choice for engineers and procurement teams building embedded systems, prototypes, or control logic implementations that benefit from configurable hardware resources and a well-defined, commercial temperature range.

Request a quote or submit an inquiry to receive pricing and availability for the XC3164-5PQ160C0304 for your next design.