XC3164-3PP132C

FPGA, 224 CLBS, 4000 GATES
Part Description

XC3100 Field Programmable Gate Array (FPGA) IC 110 46064 224 132-BPGA

Quantity 556 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package132-PGA (37.08x37.08)GradeCommercialOperating Temperature0°C – 70°C
Package / Case132-BPGANumber of I/O110Voltage4.25 V - 5.25 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs224Number of Logic Elements/Cells224
Number of Gates4500ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits46064

Overview of XC3164-3PP132C – Field Programmable Gate Array (FPGA), 132-BPGA, 110 I/O

The XC3164-3PP132C is an AMD Field Programmable Gate Array (FPGA) in a 132-BPGA package. It provides 224 logic elements, on-chip RAM, and 110 I/O connections in a through-hole PGA footprint for designs that require moderate programmable logic capacity and flexible interfacing.

Key Features

  • Device Type  Field Programmable Gate Array (FPGA) from AMD.
  • Logic Capacity  224 logic elements for implementing custom combinational and sequential logic.
  • Embedded Memory  46,064 bits of on-chip RAM (approximately 0.046 Mbits) for small data storage and buffering.
  • I/O  110 programmable I/O pins to connect to external peripherals and interfaces.
  • Gate Equivalent  Equivalent to approximately 4,500 gates for logic complexity assessment.
  • Power Supply  Operating supply range of 4.25 V to 5.25 V.
  • Package & Mounting  132-BPGA / 132-PGA package (37.08 × 37.08 mm) with through-hole mounting.
  • Operating Range & Grade  Commercial grade operation from 0 °C to 70 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Embedded control and glue logic  Use the 224 logic elements and 110 I/O to implement custom control, signal routing, and interface bridging in PCB designs.
  • Prototyping and development  Through-hole 132-PGA package supports evaluation and prototyping workflows where PGA mounting is preferred.
  • Small-scale data buffering  On-chip RAM (46,064 bits) provides local storage for temporary data and buffering tasks.

Unique Advantages

  • Moderate programmable logic density: 224 logic elements provide a balance between capability and simplicity for compact designs.
  • Generous I/O count: 110 I/O pins enable multiple external connections without additional I/O expanders.
  • Standard 5 V supply compatibility: 4.25 V to 5.25 V operating range aligns with common legacy and industrial supply rails.
  • Through-hole PGA package: 132-PGA (37.08 × 37.08 mm) facilitates prototyping, socketed evaluation, and replacement workflows.
  • RoHS compliance: Meets standard environmental requirements for lead-free assembly.
  • Commercial temperature rating: Specified 0 °C to 70 °C operation for general-purpose electronics applications.

Why Choose XC3164-3PP132C?

The XC3164-3PP132C is positioned for designers who need a compact, through-hole FPGA solution with a moderate mix of logic, memory, and I/O resources. Its 224 logic elements, 110 I/O pins, and on-chip RAM offer a straightforward platform for control logic, interface bridging, and small-scale programmable tasks while supporting 5 V systems.

Backed by AMD's device family and supplied in a 132-PGA package, this FPGA is suitable for applications and development environments that prioritize ease of board-level integration and replacement. Its commercial temperature range and RoHS compliance make it appropriate for a wide range of general-purpose electronic designs.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XC3164-3PP132C.

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