XC3164-3PP132C
| Part Description |
XC3100 Field Programmable Gate Array (FPGA) IC 110 46064 224 132-BPGA |
|---|---|
| Quantity | 556 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-PGA (37.08x37.08) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-BPGA | Number of I/O | 110 | Voltage | 4.25 V - 5.25 V | ||
| Mounting Method | Through Hole | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 224 | Number of Logic Elements/Cells | 224 | ||
| Number of Gates | 4500 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46064 |
Overview of XC3164-3PP132C – Field Programmable Gate Array (FPGA), 132-BPGA, 110 I/O
The XC3164-3PP132C is an AMD Field Programmable Gate Array (FPGA) in a 132-BPGA package. It provides 224 logic elements, on-chip RAM, and 110 I/O connections in a through-hole PGA footprint for designs that require moderate programmable logic capacity and flexible interfacing.
Key Features
- Device Type Field Programmable Gate Array (FPGA) from AMD.
- Logic Capacity 224 logic elements for implementing custom combinational and sequential logic.
- Embedded Memory 46,064 bits of on-chip RAM (approximately 0.046 Mbits) for small data storage and buffering.
- I/O 110 programmable I/O pins to connect to external peripherals and interfaces.
- Gate Equivalent Equivalent to approximately 4,500 gates for logic complexity assessment.
- Power Supply Operating supply range of 4.25 V to 5.25 V.
- Package & Mounting 132-BPGA / 132-PGA package (37.08 × 37.08 mm) with through-hole mounting.
- Operating Range & Grade Commercial grade operation from 0 °C to 70 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded control and glue logic Use the 224 logic elements and 110 I/O to implement custom control, signal routing, and interface bridging in PCB designs.
- Prototyping and development Through-hole 132-PGA package supports evaluation and prototyping workflows where PGA mounting is preferred.
- Small-scale data buffering On-chip RAM (46,064 bits) provides local storage for temporary data and buffering tasks.
Unique Advantages
- Moderate programmable logic density: 224 logic elements provide a balance between capability and simplicity for compact designs.
- Generous I/O count: 110 I/O pins enable multiple external connections without additional I/O expanders.
- Standard 5 V supply compatibility: 4.25 V to 5.25 V operating range aligns with common legacy and industrial supply rails.
- Through-hole PGA package: 132-PGA (37.08 × 37.08 mm) facilitates prototyping, socketed evaluation, and replacement workflows.
- RoHS compliance: Meets standard environmental requirements for lead-free assembly.
- Commercial temperature rating: Specified 0 °C to 70 °C operation for general-purpose electronics applications.
Why Choose XC3164-3PP132C?
The XC3164-3PP132C is positioned for designers who need a compact, through-hole FPGA solution with a moderate mix of logic, memory, and I/O resources. Its 224 logic elements, 110 I/O pins, and on-chip RAM offer a straightforward platform for control logic, interface bridging, and small-scale programmable tasks while supporting 5 V systems.
Backed by AMD's device family and supplied in a 132-PGA package, this FPGA is suitable for applications and development environments that prioritize ease of board-level integration and replacement. Its commercial temperature range and RoHS compliance make it appropriate for a wide range of general-purpose electronic designs.
Request a quote or submit a purchase inquiry to receive pricing and availability for the XC3164-3PP132C.

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