XC3164-4PP132C

FPGA, 224 CLBS, 4000 GATES
Part Description

XC3100 Field Programmable Gate Array (FPGA) IC 110 46064 224 132-BPGA

Quantity 836 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package132-PGA (37.08x37.08)GradeCommercialOperating Temperature0°C – 70°C
Package / Case132-BPGANumber of I/O110Voltage4.25 V - 5.25 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs224Number of Logic Elements/Cells224
Number of Gates4500ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits46064

Overview of XC3164-4PP132C – XC3100 Field Programmable Gate Array (FPGA) IC 110 46064 224 132-BPGA

The XC3164-4PP132C is a field programmable gate array (FPGA) designed for commercial applications that require configurable digital logic and flexible I/O. This device provides 224 logic elements, approximately 46,064 bits of embedded RAM, and 110 user I/O pins in a 132-BPGA package.

With a nominal supply range of 4.25 V to 5.25 V and an operating temperature range of 0 °C to 70 °C, the XC3164-4PP132C is suited for general-purpose board-level designs and prototyping where through-hole mounting and RoHS compliance are required.

Key Features

  • Logic Capacity  224 logic elements for implementing custom combinational and sequential logic functions suitable for small to medium complexity designs.
  • Embedded Memory  Approximately 46,064 bits of on-chip RAM for buffering, small data tables, and state storage within the FPGA fabric.
  • I/O  110 user I/O pins to support peripheral interfacing, bus connections, and signal routing at the board level.
  • Gate Count  About 4,500 gates to characterize the overall logic scale and integration level of the device.
  • Power  Operates from a 4.25 V to 5.25 V supply range, suitable for systems using standard 5 V rails.
  • Package & Mounting  132-BPGA package (supplier device package: 132-PGA (37.08x37.08)) with through-hole mounting for ease of handling during development and repair.
  • Operating Range  Commercial-grade operation from 0 °C to 70 °C for typical business and development environments.
  • Environmental Compliance  RoHS compliant to meet common lead-free assembly and procurement requirements.

Typical Applications

  • Prototyping and Development  Board-level prototyping where configurable logic and a through-hole, serviceable package simplify iteration and testing.
  • Embedded Control  Small to medium complexity control functions that leverage 224 logic elements and on-chip RAM for state machines and control logic.
  • I/O Expansion  Providing additional programmable I/O for systems that need flexible signal interfacing with 110 available I/O pins.

Unique Advantages

  • Right-sized Logic Integration: 224 logic elements and roughly 4,500 gates provide a compact programmable solution for moderate logic requirements without overprovisioning.
  • On-chip RAM for Local Storage: Approximately 46,064 bits of embedded memory enable local buffering and state retention that reduce external memory needs.
  • High I/O Count: 110 I/O pins allow extensive peripheral and bus connectivity directly from the FPGA fabric.
  • Through-Hole Package for Ease of Handling: Through-hole mounting and the 132-BPGA footprint simplify manual assembly, debugging, and replacement during development cycles.
  • Commercial Temperature and RoHS Compliance: Designed for commercial-temperature operation (0 °C to 70 °C) and RoHS-compliant manufacturing environments.

Why Choose XC3164-4PP132C?

The XC3164-4PP132C balances compact programmable logic with practical on-chip memory and a generous I/O complement, making it a fit for designers who need configurable logic, local data storage, and flexible interfacing in a commercial-grade FPGA. Its through-hole 132-BPGA package and standard 5 V supply range support straightforward integration on development and production boards.

This device is well suited to teams focused on rapid prototyping, embedded control, and I/O expansion where RoHS compliance and commercial-temperature operation align with project requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3164-4PP132C and to discuss how it can meet your design requirements.

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