XC3164-5PP132C0272

The XC3164-5PP132C0272 is a field programmable gate array (FPGA) offered in a 132‑pin ball/grid package intended for commercial embedded designs. It provides a modest logic capacity with 224 logic elements, approximately 46,064 bits of embedded RAM, and up to 110 general-purpose I/O pins for implementing custom logic, glue logic, and peripheral interfacing.

Designed for 5 V systems (4.25 V to 5.25 V operating range) and specified for commercial operating conditions (0 °C to 70 °C), this device is suited to development, prototyping, and production applications where a compact, socketable PGA package and through‑hole mounting are preferred.

Key Features

• Logic Capacity  224 logic elements (cells) and approximately 4,500 gates for implementing custom combinational and sequential logic functions.
• Embedded Memory  Approximately 46,064 bits of on‑chip RAM to store lookup tables, small buffers, and state machine data.
• I/O  Up to 110 I/O pins available for interfacing with peripherals, sensors, buses, and external logic.
• Package & Mounting  132‑BPGA / 132‑PGA package with dimensions 37.08 × 37.08 mm and through‑hole mounting suitable for socketed or board‑level installations.
• Power  Specified operating voltage range of 4.25 V to 5.25 V to match standard 5 V digital environments.
• Temperature & Grade  Commercial grade device rated for an operating temperature range of 0 °C to 70 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Prototyping and Development  Use the XC3164-5PP132C0272 for board‑level prototypes and proof‑of‑concept designs where a socketable PGA package is desirable.
• Interface and Glue Logic  110 I/O lines and modest logic capacity make this FPGA suitable for bridging buses, protocol conversion, and consolidating discrete logic functions.
• Custom Controllers  Implement compact control logic, state machines, and peripheral controllers for commercial embedded systems operating at standard 5 V.

Unique Advantages

• Right‑sized Logic Density: 224 logic elements and ~4,500 gates provide a balanced capacity for small to moderate custom logic tasks without unnecessary complexity.
• Built‑in Memory: Approximately 46 kbits of embedded RAM helps reduce the need for external buffers and simplifies design partitioning.
• Generous I/O Count: 110 I/O pins allow flexible interfacing with multiple peripherals, sensors, and external devices.
• Socketable PGA Package: The 132‑PGA (37.08 × 37.08 mm) through‑hole package supports easy board replacement, prototyping, and low‑volume production methods.
• Standard 5 V Compatibility: Operates across a 4.25 V to 5.25 V range to align with legacy and common commercial digital systems.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose XC3164-5PP132C0272?

The XC3164-5PP132C0272 positions itself as a practical FPGA choice for commercial embedded applications that require a compact logic resource, on‑chip memory, and a high I/O count in a socketable PGA package. Its combination of 224 logic elements, approximately 46 kbits of RAM, and 110 I/Os delivers the integration needed to consolidate glue logic and implement custom controllers while simplifying board design and assembly.

This device is well suited to engineers and teams focused on prototyping, small‑volume production, or designs that benefit from through‑hole, socketed packages. The clear electrical and thermal specifications make it straightforward to evaluate for 5 V commercial systems where RoHS compliance is required.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and ordering information for the XC3164-5PP132C0272.