XC3190-5PQ208C

The XC3190-5PQ208C is a field programmable gate array (FPGA) device from AMD offering configurable digital logic, on-chip RAM, and a high I/O count in a surface-mount package. It provides 320 logic elements, 64,160 bits of embedded RAM and 144 I/O pins, making it suitable for commercial embedded designs that require moderate logic capacity and ample peripheral connectivity.

Designed for 5 V systems and packaged in a 208-pin BFQFP with exposed pad, this FPGA targets applications where integration of configurable logic, I/O density and board-level thermal considerations are important.

Key Features

• Logic Capacity — 320 logic elements for implementing customizable combinational and sequential logic functions.
• On‑Chip Memory — Total RAM of 64,160 bits to support buffering, state storage and small lookup tables directly on the device.
• I/O Density — 144 user I/O pins to interface with multiple peripherals, sensors and external devices.
• Gate Count — Approximately 6,000 gates, providing a clear indicator of overall device scale for partitioning designs.
• Power — Operates from a 4.75 V to 5.25 V supply range, suitable for systems using a standard 5 V rail.
• Package & Mounting — 208‑pin BFQFP with exposed pad (supplier package: 208‑PQFP, 28×28) for surface mount assembly and enhanced PCB thermal coupling.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operation, appropriate for commercial electronic environments.
• RoHS Compliance — Device is RoHS compliant, supporting environmental regulatory requirements.

Typical Applications

• Commercial Embedded Control — Implement control logic and peripheral interfacing in 5 V embedded systems that require moderate programmable logic and multiple I/O connections.
• Instrumentation & Test Equipment — Use on-chip RAM and configurable logic for data buffering, signal conditioning control and custom timing functions.
• Consumer Electronics — Integrate user interface control, simple protocol bridging and glue logic in compact, surface-mount designs.
• Prototyping and Development — Evaluate and iterate digital designs that need a modest number of logic elements and plentiful I/O before scaling to higher-density devices.

Unique Advantages

• Balanced Integration: Combines 320 logic elements, 64,160 bits of RAM and 144 I/O to deliver a compact programmable solution that reduces external glue logic.
• 5 V System Compatibility: Native operation from a 4.75 V to 5.25 V supply aligns with legacy and existing 5 V power architectures.
• High I/O Count: 144 I/O pins simplify direct interfacing to multiple peripherals and sensors, minimizing the need for I/O expanders.
• Thermally Aware Package: 208‑pin BFQFP with exposed pad supports surface-mount assembly and helps with board-level thermal management.
• RoHS Compliant: Meets common environmental requirements for electronic product designs.

Why Choose XC3190-5PQ208C?

The XC3190-5PQ208C is positioned for designers who need a moderate-capacity FPGA with substantial I/O and on‑chip memory while operating on a standard 5 V rail. Its combination of 320 logic elements, 64,160 bits of embedded RAM and 144 I/O pins makes it well suited to commercial embedded systems, instrumentation, consumer devices and prototyping tasks that benefit from configurable logic and local RAM.

As a commercially graded, RoHS-compliant device in a 208‑pin BFQFP exposed‑pad package, it offers a practical balance of integration, board-level thermal considerations and straightforward assembly for cost-sensitive designs and development projects.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the XC3190-5PQ208C.