XC3190-PG175IPH

XC3190 - XC3000 SERIES FIELD PRO
Part Description

XC3100 Field Programmable Gate Array (FPGA) IC 144 64160 175-BCPGA

Quantity 797 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package175-CPGA (42.16x42.16)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case175-BCPGANumber of I/O144Voltage4.5 V - 5.5 V
Mounting MethodThrough HoleRoHS ComplianceUnknownREACH ComplianceREACH Affected
Moisture Sensitivity LevelVendor UndefinedNumber of LABs/CLBs320Number of Logic Elements/Cells320
Number of Gates6000ECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits64160

Overview of XC3190-PG175IPH – XC3100 Field Programmable Gate Array (FPGA) IC, 144 I/Os, 64160 bits, 175-BCPGA

The XC3190-PG175IPH is an AMD XC3100 series Field Programmable Gate Array (FPGA) provided in a 175-BCPGA through-hole package. It delivers a compact, reprogrammable logic solution featuring 320 logic elements, approximately 0.064 Mbits of embedded RAM, and 144 I/O pins for flexible interfacing.

Designed and specified for industrial use, this device supports a 4.5 V to 5.5 V supply range and an operating temperature span of −40 °C to 85 °C, making it suitable for embedded and industrial control applications that require medium-density logic, on-chip memory and robust I/O capability.

Key Features

  • Core Logic  320 logic elements (320 logic cells) providing configurable logic resources suitable for moderate-density programmable designs; approximately 6,000 equivalent gates.
  • Embedded Memory  Approximately 0.064 Mbits (64,160 bits) of on-chip RAM to support buffering, small lookup tables, and state storage without external memory.
  • I/O Capacity  144 general-purpose I/O pins to accommodate multiple peripheral interfaces, sensor connections, and control signals.
  • Package & Mounting  175-BCPGA package (supplier device package: 175-CPGA, 42.16 × 42.16 mm) in a through-hole mounting style for reliable mechanical retention and compatibility with legacy boards or prototyping fixtures.
  • Power  Operates from a 4.5 V to 5.5 V supply, enabling straightforward integration into 5 V-based systems.
  • Environmental & Grade  Industrial grade device with an operating temperature range of −40 °C to 85 °C and RoHS compliance for environmental regulatory alignment.

Typical Applications

  • Industrial Control  Implement custom logic, simple state machines, and I/O management in factory automation and process control equipment operating across industrial temperature ranges.
  • Embedded Systems  Serve as a reprogrammable glue-logic or interface controller within embedded platforms that require moderate logic density and on-chip memory.
  • Prototyping and Development  Through-hole 175-BCPGA packaging and accessible I/O make the device convenient for board-level prototyping, evaluation, and iterative firmware/hardware development.
  • Interface Bridging  Provide customizable signal routing and protocol adaptation between multiple peripherals or legacy interfaces using abundant I/O and configurable logic.

Unique Advantages

  • Moderate Logic Density:  320 logic elements and ~6,000 gates give designers sufficient programmable resources for glue logic and medium-complexity functions without unnecessary cost or power.
  • On-Chip RAM:  Approximately 64 Kbits of embedded RAM reduces dependency on external memory for buffering and small data structures, simplifying PCB design.
  • High I/O Count:  144 I/O pins allow extensive peripheral and sensor connections, minimizing the need for additional I/O expanders.
  • Robust Industrial Specification:  Industrial operating temperature range (−40 °C to 85 °C) and RoHS compliance support deployment in regulated and temperature-variable environments.
  • Through-Hole Packaging:  175-BCPGA through-hole package offers mechanical stability and ease of replacement for development boards or long-life installations.
  • Standard 5 V Supply Range:  Compatibility with 4.5 V–5.5 V systems makes the device suitable for existing 5 V infrastructures, reducing power-rail design changes.

Why Choose XC3190-PG175IPH?

The XC3190-PG175IPH combines a practical balance of programmable logic, on-chip memory and extensive I/O in a through-hole 175-BCPGA package tailored for industrial-grade applications. Its specified operating temperature range and RoHS compliance make it a reliable choice for embedded and control-system designers seeking a reprogrammable solution with moderate resource requirements.

This FPGA is well suited to teams needing scalable, maintainable logic functions—such as protocol adaptation, glue logic, and small buffering tasks—while maintaining compatibility with 5 V designs and through-hole assembly workflows.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XC3190-PG175IPH. Our team can assist with ordering and volume options for your project needs.

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