XC4003E-3PG120C

IC FPGA 80 I/O 120CPGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 80 3200 238 120-BCPGA

Quantity 217 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package120-CPGA (34.54x34.54)GradeCommercialOperating Temperature0°C – 85°C
Package / Case120-BCPGANumber of I/O80Voltage4.75 V - 5.25 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs100Number of Logic Elements/Cells238
Number of Gates3000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits3200

Overview of XC4003E-3PG120C – XC4000E/X Field Programmable Gate Array, 80 I/O, 238 Logic Elements, 120-BCPGA

The XC4003E-3PG120C is a commercial‑grade Field Programmable Gate Array (FPGA) offered in a 120-BCPGA package. It provides a moderate-density programmable logic fabric with 238 logic elements and approximately 3,200 bits of embedded RAM, paired with 80 user I/O pins for interfacing and system integration.

Designed for applications that require configurable logic, multiple I/O and on‑chip memory within a through‑hole 120-CPGA (34.54 × 34.54 mm) footprint, this device operates from a 4.75 V to 5.25 V supply and across a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Capacity  Provides 238 logic elements (LEs) supporting up to 3,000 gates for implementing custom digital logic functions and small to moderate complexity designs.
  • Embedded Memory  Approximately 3,200 bits of on-chip RAM for temporary storage, buffering and small data tables directly inside the FPGA fabric.
  • I/O  80 user I/O pins available for flexible interfacing with peripheral devices, sensors and external logic.
  • Power  Single 5 V class supply operation with a specified input range of 4.75 V to 5.25 V simplifies power rail planning for legacy and 5 V systems.
  • Package & Mounting  120-BCPGA / 120-CPGA package (34.54 × 34.54 mm) with through‑hole mounting for robust mechanical retention and ease of prototyping or retrofit.
  • Operating Range  Commercial temperature grade rated from 0 °C to 85 °C for standard electronics applications.
  • Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

  • Prototype Development  Use the XC4003E-3PG120C for board‑level prototyping and validation of custom digital logic where 238 logic elements and on‑chip RAM meet design needs.
  • Embedded Control  Suited to embedded control and glue‑logic tasks that require multiple I/O and modest on‑chip memory within a 5 V power domain.
  • Digital I/O Expansion  Ideal for designs that need to add programmable I/O handling and simple data processing functions to existing systems.

Unique Advantages

  • Compact, integrated solution: Combines logic, on‑chip RAM and 80 I/O pins in a single 120-BCPGA package to reduce board complexity and component count.
  • Legacy-friendly power: Operates from a 4.75 V to 5.25 V supply, making it straightforward to integrate into systems with existing 5 V rails.
  • Through‑hole package option: 120-CPGA through‑hole mounting enables durable mechanical attachment and simplifies prototyping and retrofit tasks.
  • Regulatory alignment: RoHS compliance supports modern manufacturing and environmental requirements.
  • Predictable operating range: Commercial 0 °C to 85 °C rating provides clear thermal boundaries for standard electronic applications.

Why Choose XC4003E-3PG120C?

The XC4003E-3PG120C positions itself as a practical choice for designers needing moderate programmable logic density, on‑chip memory and a substantial I/O complement in a through‑hole 120-BCPGA package. Its 238 logic elements and approximately 3,200 bits of embedded RAM offer a compact platform for custom digital functions and interfacing tasks within a 5 V power environment.

This device is well suited to teams developing prototypes, embedded control solutions or I/O expansion modules that value straightforward integration, RoHS compliance and the mechanical robustness of a CPGA package. The XC4003E-3PG120C delivers a balanced combination of integration and predictable electrical and thermal parameters for commercial applications.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4003E-3PG120C.

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