XC4003E-3PG120I

IC FPGA 80 I/O 120CPGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 80 3200 238 120-BCPGA

Quantity 1,437 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package120-CPGA (34.54x34.54)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case120-BCPGANumber of I/O80Voltage4.5 V - 5.5 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs100Number of Logic Elements/Cells238
Number of Gates3000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits3200

Overview of XC4003E-3PG120I – XC4000E/X Field Programmable Gate Array (FPGA) IC

The XC4003E-3PG120I is an AMD XC4000E/X-series FPGA packaged in a 120-BCPGA form factor. Designed as a configurable digital logic device, it provides on-chip memory, a defined set of I/O, and a moderate logic capacity for embedded and industrial electronic designs.

Key Features

  • Logic Capacity  Provides 238 logic elements and approximately 3,000 gates to implement custom digital functions and control logic.
  • Embedded Memory  Includes 3,200 bits of on-chip RAM for small lookup tables, state storage, and buffering.
  • I/O Count  Offers 80 user I/O signals to interface with peripherals, sensors, and external logic.
  • Power  Operates from a 4.5 V to 5.5 V supply range compatible with common 5 V systems.
  • Package & Mounting  Supplied in a 120-BCPGA package (supplier device package: 120-CPGA (34.54x34.54)) with a through-hole mounting type for robust board attachment.
  • Temperature & Grade  Industrial-grade device rated for operation from -40°C to 100°C, suitable for higher-temperature embedded environments.
  • Regulatory Compliance  RoHS compliant to meet lead-free assembly requirements.

Typical Applications

  • Industrial Control  Implement custom control logic and interface functions for industrial equipment where an industrial temperature range and through-hole mounting are required.
  • Embedded Systems  Provide glue logic, finite-state machines, and small custom processors in embedded designs that require moderate logic and on-chip RAM.
  • Prototyping & Development  Through-hole package and defined I/O count simplify board-level evaluation and iterative hardware development.

Unique Advantages

  • Balanced Logic and Memory:  238 logic elements combined with 3,200 bits of on-chip RAM support compact custom logic implementations without immediate external memory.
  • Robust Industrial Range:  Rated from -40°C to 100°C, enabling deployment in temperature-challenging environments.
  • Straightforward Integration:  80 I/O pins and a standard 5 V supply window simplify interfacing with legacy and contemporary 5 V systems.
  • Durable Mounting:  Through-hole package gives strong mechanical retention for boards exposed to vibration or manual handling.
  • Regulatory Compatibility:  RoHS compliance supports lead-free assembly processes and regulatory requirements.

Why Choose XC4003E-3PG120I?

The XC4003E-3PG120I positions itself as an industrial-grade FPGA that balances moderate logic resources with on-chip RAM and a substantial I/O count, all in a through-hole 120-BCPGA package. It is suited to designers and engineers who need configurable logic, reliable operation across a wide temperature range, and easy board-level integration for embedded and control-oriented systems.

With a defined supply range and RoHS compliance, this device provides clear, verifiable specifications for procurement and system design where 5 V operation, mechanical robustness, and industrial temperature tolerance are priorities.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the XC4003E-3PG120I and to receive assistance tailoring it to your application needs.

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