XC4010E-3PQ160C

IC FPGA 129 I/O 160QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 129 12800 950 160-BQFP

Quantity 659 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package160-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case160-BQFPNumber of I/O129Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs400Number of Logic Elements/Cells950
Number of Gates10000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits12800

Overview of XC4010E-3PQ160C – XC4000E/X FPGA, 950 logic elements, 160-BQFP

The XC4010E-3PQ160C is a Field Programmable Gate Array (FPGA) IC in the XC4000E/X family from AMD. It delivers a mid-range programmable logic resource set suitable for configurable digital logic integration.

Key on-chip resources include 950 logic elements, approximately 12,800 bits of embedded RAM, 129 user I/O pins and an equivalent of 10,000 gates, all supplied in a 160-pin BQFP surface-mount package. The device is specified for a 4.75 V to 5.25 V supply and a commercial operating temperature range of 0 °C to 85 °C, and is RoHS compliant.

Key Features

  • Core Logic  950 logic elements providing configurable logic capacity for custom digital functions.
  • On‑Chip Memory  Approximately 12,800 bits of embedded RAM for state storage, buffering and small on-chip tables.
  • I/O and Gate Equivalent  129 user I/O pins and an internal equivalent of 10,000 gates to support interfacing and system logic.
  • Power Supply  Operates from a 4.75 V to 5.25 V supply range.
  • Package & Mounting  160-BQFP package case; supplier device package listed as 160-PQFP (28×28). Surface-mount mounting type for PCB assembly.
  • Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for use in lead‑free assemblies.

Typical Applications

  • Custom Logic Implementation  Implement configurable digital functions and glue logic using the device’s 950 logic elements and embedded RAM.
  • I/O‑Intensive Interfaces  Support multiple peripheral connections and board-level signaling with 129 available I/O pins.
  • Prototyping and System Integration  Integrate programmable logic into prototype and production boards using the surface-mount 160‑pin package and standard 5 V supply.

Unique Advantages

  • Balanced Logic Density: 950 logic elements provide mid-range capacity for a wide variety of configurable designs without excessive resource overhead.
  • On‑Chip RAM for Local Storage: Approximately 12,800 bits of embedded memory enable small buffers, FIFOs or state tables without external memory.
  • High I/O Count: 129 user I/Os reduce the need for external expanders and simplify board-level interfacing.
  • Standard 5 V Operation: 4.75 V to 5.25 V supply range supports designs that use legacy or common 5 V rails.
  • Surface‑Mount 160‑Pin Package: The 160-BQFP/160-PQFP (28×28) package offers a compact solderable footprint for PCB integration.
  • RoHS Compliance: Meets RoHS requirements for lead‑free manufacturing processes.

Why Choose XC4010E-3PQ160C?

The XC4010E-3PQ160C positions as a practical, mid-range FPGA from AMD, combining 950 logic elements, modest embedded RAM, and a high I/O count in a 160‑pin surface‑mount package. Its 5 V supply range and commercial temperature rating make it suitable for a range of embedded and board-level programmable logic tasks.

Designers looking for a compact, RoHS-compliant FPGA with balanced logic density and plentiful I/O will find this device appropriate for integrating customizable logic, interfacing subsystems, and consolidating discrete components into programmable logic solutions.

Request a quote or submit an inquiry to check pricing, availability and lead time for the XC4010E-3PQ160C.

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