XC4010E-3PQ160I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 129 12800 950 160-BQFP |
|---|---|
| Quantity | 809 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 160-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 160-BQFP | Number of I/O | 129 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 950 | ||
| Number of Gates | 10000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12800 |
Overview of XC4010E-3PQ160I – XC4000E/X Field Programmable Gate Array (FPGA) IC 129 12800 950 160-BQFP
The XC4010E-3PQ160I is a field programmable gate array (FPGA) IC from AMD, offering a compact programmable-logic solution in a 160-pin BQFP package. The device provides a combination of logic resources, on-chip RAM and a substantial I/O count suitable for industrial applications.
With 950 logic elements, approximately 12,800 bits of embedded memory, and 129 user I/O, this FPGA is positioned for designs that require moderate logic capacity, embedded memory and flexible I/O in an industrial temperature range.
Key Features
- Logic Capacity 950 logic elements and approximately 10,000 gates provide the programmable resources for custom combinational and sequential logic implementation.
- Embedded Memory 12,800 bits of on-chip RAM (approximately 0.013 Mbits) for small buffers, FIFOs or state storage.
- I/O Resources 129 user I/O pins to support a wide range of peripheral interfaces and board-level connectivity.
- Power Operates from a 4.5 V to 5.5 V supply range to match legacy and 5 V domain systems.
- Package & Mounting 160-BQFP package (supplier device package: 160-PQFP, 28×28 mm) in a surface-mount form factor for standard PCB assembly.
- Temperature & Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployments in harsher environments.
- Environmental Compliance RoHS compliant.
Unique Advantages
- Balanced logic and gate count: 950 logic elements and ~10,000 gates provide a practical balance of resources for mid-range programmable tasks without excessive board area.
- On-chip memory for local data handling: 12,800 bits of embedded RAM enables small data buffering and state retention without external memory.
- Generous I/O density: 129 I/O pins support multiple external interfaces and flexible signal routing on multi-function boards.
- Wide industrial temperature range: Rated from −40 °C to 100 °C to support industrial installations and extended-temperature applications.
- Standard surface-mount packaging: 160-BQFP (160-PQFP, 28×28) simplifies PCB layout and is compatible with common assembly processes.
- Regulatory alignment: RoHS compliance helps meet environmental and supply-chain requirements.
Why Choose XC4010E-3PQ160I?
The XC4010E-3PQ160I delivers a compact FPGA option from AMD that combines a useful logic element count, embedded RAM and a high I/O count in a 160-pin surface-mount package. Its industrial temperature rating and wide supply-voltage range make it suitable for designs requiring reliable programmable logic in demanding environments.
This device is well suited to engineers and procurement teams seeking a mid-range FPGA for industrial systems that need programmable flexibility, local memory and substantial I/O density while maintaining RoHS compliance.
Request a quote or submit an inquiry today for pricing and availability of the XC4010E-3PQ160I.

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