XC4010E-4BG225C
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 160 12800 950 225-BBGA |
|---|---|
| Quantity | 218 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 225-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 225-BBGA | Number of I/O | 160 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 950 | ||
| Number of Gates | 10000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12800 |
Overview of XC4010E-4BG225C – XC4000E/X FPGA IC 160 I/O 225-BBGA
The XC4010E-4BG225C is a Field Programmable Gate Array (FPGA) from AMD's XC4000E/X family, packaged in a 225-ball BGA. It provides a compact, surface-mount programmable logic solution with a defined set of logic resources, embedded RAM and a high I/O count for commercial-grade digital designs.
With up to 950 logic elements, approximately 0.0128 Mbits of embedded memory, and 160 user I/O pins, this device targets applications that require moderate on-chip logic capacity, flexible I/O, and a standard 5 V supply range for straightforward system integration.
Key Features
- Logic Capacity Approximately 950 logic elements for implementing combinational and sequential logic functions in a compact FPGA footprint.
- Embedded Memory Approximately 0.0128 Mbits (12,800 bits) of on-chip RAM suitable for small lookup tables, FIFOs or state storage.
- I/O Density 160 user I/O pins to support multiple parallel interfaces, external peripherals and board-level glue logic.
- Gate Equivalent Rated at 10,000 gates for sizing designs that require a defined gate-count reference.
- Power Single supply operation from 4.75 V to 5.25 V to match common 5 V system rails.
- Package & Mounting 225-ball BGA (supplier device package: 225-PBGA, 27×27) in a surface-mount package for compact PCB designs.
- Operating Conditions Commercial-grade operating temperature range of 0 °C to 85 °C for typical ambient environments.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Digital Logic Prototyping Implement and iterate custom digital logic, state machines and control functions during product development.
- I/O Expansion & Glue Logic Bridge between multiple peripherals or subsystems using the device's 160 I/O pins to consolidate board-level routing.
- Peripheral Interfacing Create custom interface logic for sensors, actuators or communication peripherals that require tailored signal handling.
- Embedded Control Functions Integrate control and sequencing logic for compact systems where a moderate amount of on-chip logic and RAM is sufficient.
Unique Advantages
- Balanced Logic and I/O A combination of about 950 logic elements and 160 I/O pins enables moderately complex designs without excessive board-level peripherals.
- Simplified Power Integration Runs from a 4.75 V–5.25 V supply for compatibility with standard 5 V system architectures, reducing power-supply design complexity.
- Compact BGA Package 225-ball BGA (225-PBGA, 27×27) minimizes PCB footprint while providing a high pin count for dense designs.
- Commercial Temperature Rating Specified 0 °C to 85 °C operation suitable for typical commercial electronics and office-environment products.
- RoHS Compliance Meets environmental compliance expectations for modern electronic assemblies.
- Manufacturer Backing Part of AMD's XC4000E/X family, providing continuity for projects that reference this product family.
Why Choose XC4010E-4BG225C?
The XC4010E-4BG225C provides a focused balance of logic resources, embedded memory and a large I/O count in a compact 225-ball BGA package—making it suitable for designers who need moderate on-chip logic capacity and extensive external interfacing on a 5 V platform. Its commercial-grade temperature range and RoHS compliance make it appropriate for a wide range of standard electronics projects.
This device is well suited to teams building prototypes, control logic and interface glue that require predictable resources and a compact footprint, and for procurement where AMD family continuity is a factor in design planning.
Request a quote or contact sales to discuss availability, lead times and pricing for the XC4010E-4BG225C.

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