XC4013E-4BG225I

The XC4013E-4BG225I is an AMD FPGA from the XC4000E/X family offering medium-density programmable logic and on-chip memory in a 225-ball BGA package. It provides 1,368 logic elements, approximately 18,432 bits of embedded RAM and 192 general-purpose I/O pins, making it suitable for industrial embedded designs that require configurable digital logic and substantial I/O integration.

Designed for surface-mount applications, the device operates from a 4.5 V to 5.5 V supply and is specified for industrial temperature operation from −40°C to 100°C. The part is RoHS compliant.

Key Features

• Core & Logic  Approximately 1,368 logic elements implementing roughly 13,000 gates for medium-scale custom logic and control functions.
• Embedded Memory  Approximately 18,432 bits of on-chip RAM to support buffering, small FIFOs and local data storage.
• Input/Output  192 I/O pins to support wide peripheral and bus interfacing without external I/O expanders.
• Package & Mounting  225-ball BGA package (supplier device package: 225-PBGA, 27×27) in a surface-mount form factor for compact PCB integration.
• Power  Operates from a 4.5 V to 5.5 V supply voltage range to match common industrial logic rails.
• Temperature & Grade  Industrial grade with an operating range of −40°C to 100°C for deployment in rugged environments.
• Compliance  RoHS compliant for alignment with lead-free manufacturing requirements.

Typical Applications

• Industrial Control  Custom control logic, I/O aggregation and protocol bridging using the device's 192 I/Os and industrial temperature rating.
• Embedded Systems  Glue logic, peripheral interface handling and small-scale state machines leveraging 1,368 logic elements and on-chip RAM.
• Signal and Data Conditioning  Medium-complexity data handling and buffering tasks using the device's embedded memory and gate count.

Unique Advantages

• Balanced Logic Density: The combination of approximately 1,368 logic elements and ~13,000 gates supports medium-complexity designs without excessive part overhead.
• High I/O Count: 192 general-purpose I/Os reduce the need for external I/O expanders and simplify board-level design for multi-peripheral systems.
• On-Chip Memory: Approximately 18,432 bits of embedded RAM provide local buffering and small data storage to improve system responsiveness.
• Industrial Robustness: Rated for −40°C to 100°C operation and marked as industrial grade for deployment in demanding environments.
• Compact Packaging: 225-ball BGA (27×27) enables a compact footprint for space-constrained PCBs while maintaining high pin count.
• RoHS Compliant: Supports lead-free manufacturing processes and regulatory requirements for many production environments.

Why Choose XC4013E-4BG225I?

The XC4013E-4BG225I offers a practical balance of logic, memory and I/O in a compact, industrial-grade package. Its specifications make it well suited to engineers designing medium-complexity programmable logic into embedded and industrial applications where a moderate gate count, significant I/O density and wide operating temperature range are required.

For teams seeking a RoHS-compliant FPGA solution with straightforward power requirements (4.5 V–5.5 V) and a high I/O count in a space-efficient BGA package, the XC4013E-4BG225I delivers configurable integration and the deployment robustness expected for industrial environments.

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