XC4013E-4HQ240I

IC FPGA 192 I/O 240QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP Exposed Pad

Quantity 202 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFP Exposed PadNumber of I/O192Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates13000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XC4013E-4HQ240I – XC4000E/X Field Programmable Gate Array (FPGA) IC

The XC4013E-4HQ240I is a field programmable gate array (FPGA) IC from AMD built on the XC4000E/X family architecture. It provides a balanced combination of logic capacity, on-chip memory and I/O in a surface-mount package designed for industrial-grade applications.

Key device characteristics include 1,368 logic elements, 18,432 bits of embedded RAM, 192 user I/O pins and an operating voltage range of 4.5 V to 5.5 V, with an industrial temperature rating from -40 °C to 100 °C.

Key Features

  • Logic Capacity  Contains 1,368 logic elements providing programmable combinational and sequential resources for custom digital logic implementations.
  • On‑Chip Memory  Includes 18,432 bits of total embedded RAM for local buffering, state storage and small FIFOs.
  • I/O Density  192 user I/O pins enable connection to multiple peripherals, buses and external logic devices within a single FPGA.
  • Gate Count  Approximately 13,000 gates of logical density for implementing medium-complexity designs.
  • Power  Operates from a 4.5 V to 5.5 V supply, suitable for 5 V systems and interfaces.
  • Package & Mounting  240‑lead BFQFP with exposed pad (supplier device package listed as 240‑PQFP 32×32), designed for surface‑mount PCB assembly and improved thermal contact via the exposed pad.
  • Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet a wide range of environmental conditions.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

  • Industrial Control & Automation  Implement custom control logic, interfaces and glue logic using the device’s logic elements and plentiful I/O within an industrial temperature envelope.
  • Embedded System Prototyping  Use the FPGA’s on‑chip RAM and logic resources to prototype and iterate digital designs before final ASIC or PCB integration.
  • Interface Bridging  Leverage the 192 I/O pins to translate, buffer or aggregate signals between multiple subsystems on a single FPGA.

Unique Advantages

  • Balanced Logic and Memory: 1,368 logic elements combined with 18,432 bits of embedded RAM support medium‑complexity functions without external memory.
  • High I/O Count: 192 user I/O pins reduce the need for additional interface components and simplify board-level routing for multi‑signal designs.
  • Industrial Reliability: Rated for -40 °C to 100 °C operation, enabling deployment in a wide range of environmental conditions.
  • Standard 5 V Supply: Compatibility with 4.5 V to 5.5 V systems makes the device straightforward to integrate into existing 5 V logic domains.
  • Surface‑Mount Package with Exposed Pad: 240‑lead BFQFP with exposed pad provides a compact, thermally manageable package for PCB assembly.
  • RoHS Compliant Manufacturing: Supports environmental and regulatory requirements for lead‑free assembly.

Why Choose XC4013E-4HQ240I?

The XC4013E-4HQ240I positions itself as a practical FPGA choice for engineers requiring a medium‑capacity programmable device with robust I/O and on‑chip memory in an industrial‑rated package. Its combination of 1,368 logic elements, 18,432 bits of RAM and 192 I/O pins offers integration density suitable for control logic, interface bridging and embedded prototyping tasks.

Designed for surface‑mount assembly with a thermally enhanced exposed‑pad 240‑lead package and a 4.5 V to 5.5 V supply range, this device delivers straightforward system integration and long‑term deployment in environments that demand extended temperature operation and RoHS compliance.

Request a quote or submit an RFQ to get pricing and availability for the XC4013E-4HQ240I. Our team can provide lead-time information and support for volume and prototype requirements.

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