XC4013E-4HQ240I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 202 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 192 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 1368 | ||
| Number of Gates | 13000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of XC4013E-4HQ240I – XC4000E/X Field Programmable Gate Array (FPGA) IC
The XC4013E-4HQ240I is a field programmable gate array (FPGA) IC from AMD built on the XC4000E/X family architecture. It provides a balanced combination of logic capacity, on-chip memory and I/O in a surface-mount package designed for industrial-grade applications.
Key device characteristics include 1,368 logic elements, 18,432 bits of embedded RAM, 192 user I/O pins and an operating voltage range of 4.5 V to 5.5 V, with an industrial temperature rating from -40 °C to 100 °C.
Key Features
- Logic Capacity Contains 1,368 logic elements providing programmable combinational and sequential resources for custom digital logic implementations.
- On‑Chip Memory Includes 18,432 bits of total embedded RAM for local buffering, state storage and small FIFOs.
- I/O Density 192 user I/O pins enable connection to multiple peripherals, buses and external logic devices within a single FPGA.
- Gate Count Approximately 13,000 gates of logical density for implementing medium-complexity designs.
- Power Operates from a 4.5 V to 5.5 V supply, suitable for 5 V systems and interfaces.
- Package & Mounting 240‑lead BFQFP with exposed pad (supplier device package listed as 240‑PQFP 32×32), designed for surface‑mount PCB assembly and improved thermal contact via the exposed pad.
- Industrial Temperature Range Rated for operation from -40 °C to 100 °C to meet a wide range of environmental conditions.
- RoHS Compliant Manufactured in compliance with RoHS requirements.
Typical Applications
- Industrial Control & Automation Implement custom control logic, interfaces and glue logic using the device’s logic elements and plentiful I/O within an industrial temperature envelope.
- Embedded System Prototyping Use the FPGA’s on‑chip RAM and logic resources to prototype and iterate digital designs before final ASIC or PCB integration.
- Interface Bridging Leverage the 192 I/O pins to translate, buffer or aggregate signals between multiple subsystems on a single FPGA.
Unique Advantages
- Balanced Logic and Memory: 1,368 logic elements combined with 18,432 bits of embedded RAM support medium‑complexity functions without external memory.
- High I/O Count: 192 user I/O pins reduce the need for additional interface components and simplify board-level routing for multi‑signal designs.
- Industrial Reliability: Rated for -40 °C to 100 °C operation, enabling deployment in a wide range of environmental conditions.
- Standard 5 V Supply: Compatibility with 4.5 V to 5.5 V systems makes the device straightforward to integrate into existing 5 V logic domains.
- Surface‑Mount Package with Exposed Pad: 240‑lead BFQFP with exposed pad provides a compact, thermally manageable package for PCB assembly.
- RoHS Compliant Manufacturing: Supports environmental and regulatory requirements for lead‑free assembly.
Why Choose XC4013E-4HQ240I?
The XC4013E-4HQ240I positions itself as a practical FPGA choice for engineers requiring a medium‑capacity programmable device with robust I/O and on‑chip memory in an industrial‑rated package. Its combination of 1,368 logic elements, 18,432 bits of RAM and 192 I/O pins offers integration density suitable for control logic, interface bridging and embedded prototyping tasks.
Designed for surface‑mount assembly with a thermally enhanced exposed‑pad 240‑lead package and a 4.5 V to 5.5 V supply range, this device delivers straightforward system integration and long‑term deployment in environments that demand extended temperature operation and RoHS compliance.
Request a quote or submit an RFQ to get pricing and availability for the XC4013E-4HQ240I. Our team can provide lead-time information and support for volume and prototype requirements.

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