XC4013E-4PG223C

The XC4013E-4PG223C is an AMD-manufactured FPGA from the XC4000E/X family, delivered in a 223-BCPGA through-hole package with a 223-CPGA (47.24 × 47.24 mm) supplier device footprint. It combines 1,368 logic elements and approximately 18,432 bits of on-chip RAM with 192 I/O pins to support medium-density programmable logic requirements for commercial embedded designs.

With a 4.75 V to 5.25 V supply range and a commercial operating temperature range of 0 °C to 85 °C, this device targets general-purpose commercial applications that require a balance of logic capacity, embedded memory, and a high I/O count in a through-hole package form factor.

Key Features

• Logic Capacity — 1,368 logic elements (cells) providing programmable combinational and sequential resources for glue logic, custom state machines, and control functions.
• Embedded Memory — Approximately 18,432 bits of on-chip RAM suitable for small FIFOs, lookup tables, and buffering tasks.
• I/O Resources — 192 user I/O pins to support parallel interfaces, multiple buses, and dense external connectivity.
• Gate Count — Rated at 13,000 gates for quick reference when mapping legacy designs or evaluating integration density.
• Package & Mounting — 223-BCPGA package, supplier device package 223-CPGA with dimensions 47.24 × 47.24 mm; through-hole mounting for compatibility with legacy boards and socketed prototyping.
• Power — Single supply range from 4.75 V to 5.25 V for straightforward integration into 5 V systems.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement control logic, protocol bridging, and custom peripheral interfaces within 5 V commercial equipment.
• Prototyping & Development — Through-hole 223-BCPGA package supports socketed development and board-level evaluation of programmable logic functions.
• Interface and Bus Glue Logic — High I/O count and on-chip RAM enable bus bridging, parallel interface handling, and timing adaptation between subsystems.
• Control and Sequencing — Use the available logic elements for finite-state machines, timing control, and coordination of multiple peripherals.

Unique Advantages

• Balanced Integration: Combines 1,368 logic elements with approximately 18,432 bits of embedded memory and 192 I/O pins in a single device, reducing external component count.
• Through-Hole Package Flexibility: 223-BCPGA through-hole mounting facilitates prototyping, socketed testing, and replacement on legacy PCBs.
• Straightforward Power Requirements: Standard 5 V supply range (4.75 V–5.25 V) simplifies power-supply design in existing commercial systems.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, matching typical commercial environments and systems.
• Regulatory Compliance: RoHS status ensures compatibility with current environmental directives for lead-free assembly.

Why Choose XC4013E-4PG223C?

The XC4013E-4PG223C is positioned for designers seeking a commercially graded FPGA that pairs modest logic capacity with substantial I/O and embedded RAM in a through-hole 223-BCPGA package. Its combination of 1,368 logic elements, approximately 18,432 bits of on-chip memory, and 192 I/O pins makes it well suited for medium-density programmable tasks where socketed or legacy mounting is required.

This device appeals to development teams and OEMs implementing commercial embedded control, interface logic, and prototyping efforts that rely on a 5 V supply and standard commercial temperature range. Documentation and manufacturer resources are available to support integration and design evaluation.

Request a quote or submit your inquiry to receive pricing and availability for the XC4013E-4PG223C and to discuss how this FPGA can fit your commercial embedded design needs.