XC4013E-4PG223I

IC FPGA 192 I/O 223CPGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 223-BCPGA

Quantity 1,678 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package223-CPGA (47.24x47.24)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case223-BCPGANumber of I/O192Voltage4.5 V - 5.5 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates13000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XC4013E-4PG223I – XC4000E/X Field Programmable Gate Array (FPGA) 223-BCPGA

The XC4013E-4PG223I is an AMD XC4000E/X series field programmable gate array (FPGA) in a 223-BCPGA package. It provides programmable logic resources, embedded RAM, and a broad I/O count for designs that require reconfigurable logic implemented in a through-hole package and rated for industrial temperature ranges.

Key Features

  • Core Architecture XC4000E/X series FPGA architecture implemented in the XC4013E-4PG223I device.
  • Logic Capacity 1,368 logic elements suitable for moderate-density programmable logic functions.
  • Embedded Memory Approximately 0.018 Mbits (18,432 bits) of on-chip RAM for local data and buffering.
  • I/O and Gate Count 192 general-purpose I/O pins and an estimated 13,000 gates to support interfacing and system logic.
  • Power Single-supply operation from 4.5 V to 5.5 V.
  • Package and Mounting 223-BCPGA / 223-CPGA package, package footprint approximately 47.24 × 47.24 mm, designed for through-hole mounting.
  • Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Industrial Control Use the XC4013E-4PG223I in control logic and sequencing where industrial temperature rating and through-hole mounting are required.
  • Embedded Systems Integrate reconfigurable logic and on-chip RAM for custom peripheral interfaces, protocol bridging, or glue logic in embedded designs.
  • Prototyping and Development Suitable for development platforms and upgradeable systems that benefit from field-programmable logic and a large I/O count.

Unique Advantages

  • Balanced Logic and Memory: 1,368 logic elements combined with 18,432 bits of embedded RAM provide a compact mix of resources for moderate-complexity designs.
  • High I/O Count: 192 I/O pins enable broad external interfacing options without needing additional I/O expanders.
  • Through-Hole Package: 223-BCPGA / 223-CPGA package and through-hole mounting simplify prototyping, board handling, and mechanical robustness in certain assemblies.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C to meet extended-environment deployment needs.
  • Standard 5 V Supply: Operates from 4.5 V to 5.5 V, matching legacy and industrial power rails.
  • RoHS Compliant: Meets common environmental compliance expectations for manufacturing.

Why Choose XC4013E-4PG223I?

The XC4013E-4PG223I offers a practical combination of programmable logic, embedded RAM, and a high I/O count in an industrial-grade, through-hole package. It is suited to engineers and procurement teams looking for a reconfigurable device that supports moderate logic density and comprehensive interfacing while tolerating extended temperature ranges.

Choose this device for designs that require field-programmable flexibility, a sizable number of external connections, and compatibility with 5 V system rails. Its RoHS compliance and standardized package dimensions support manufacturing and assembly considerations for a range of industrial and embedded applications.

Request a quote or submit a pricing inquiry to evaluate the XC4013E-4PG223I for your next design and to obtain availability and purchasing information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up