XC4013E-3PQ208I

The XC4013E-3PQ208I is a field-programmable gate array (FPGA) from AMD's XC4000E/X family, delivered in a 208-BFQFP surface-mount package. It provides a mid-density programmable logic platform combining logic elements, embedded RAM, and a broad I/O count for system integration.

Designed for industrial applications, this device supports a single-supply operating range and a wide operating temperature window to address robust embedded control, communication, and instrumentation designs.

Key Features

• Configurable Logic  576 logic blocks with 1,368 logic elements deliver mid-density programmable logic resources for combinational and sequential functions.
• On-chip Embedded RAM  18,432 bits of total RAM provide local storage for FIFOs, state machines, and small data buffers.
• I/O Count  160 programmable I/O pins enable broad interfacing to peripherals, sensors, and system buses.
• Logic Capacity  13,000 equivalent gates suitable for compact logic implementations and glue-logic consolidation.
• Power  Operates from a 4.5 V to 5.5 V supply range to match standard 5 V system rails.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP, 28 × 28) surface-mount package for industry-standard PCB assembly.
• Temperature & Grade  Industrial-grade device rated for operation from -40°C to 100°C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant for regulatory alignment in modern product designs.

Typical Applications

• Industrial Control  Used for logic consolidation, custom state machines, and interface bridging in factory automation and process control systems where industrial temperature operation is required.
• Communications Equipment  Provides mid-density programmable logic and dense I/O for protocol handling, data routing, and peripheral interfacing.
• Instrumentation & Test  Embedded RAM and flexible I/O make it suitable for data acquisition front-ends, timing logic, and measurement control.
• Embedded System Integration  Acts as a customizable glue-logic device to integrate multiple digital subsystems and offload discrete logic from the BOM.

Unique Advantages

• Mid-density Integration: Combines 1,368 logic elements and 18,432 bits of RAM to consolidate discrete logic and small memory needs into a single device.
• High I/O Count: 160 I/O pins enable direct connection to numerous peripherals, reducing external interface components.
• Industrial Temperature Rating: Rated from -40°C to 100°C for reliable operation in harsh or industrial environments.
• Standard Surface-Mount Package: 208-BFQFP (28 × 28) supports established PCB assembly processes and footprints.
• Simplified Power Integration: Operates on a 4.5 V to 5.5 V supply range to align with common 5 V system architectures.
• Regulatory Alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC4013E-3PQ208I?

The XC4013E-3PQ208I positions itself as a practical mid-density FPGA choice for engineers needing a balance of logic resources, embedded RAM, and abundant I/O in an industrial-grade device. Its 208-BFQFP package and single-supply operation simplify board-level integration while the -40°C to 100°C rating supports deployment in demanding environments.

This device is well suited to teams designing control systems, communication modules, and test equipment that require a programmable, RoHS-compliant logic element from a recognized manufacturer. Its combination of logic capacity, on-chip memory, and I/O flexibility offers a scalable platform for prototype through production designs.

Request a quote or submit a pricing inquiry to receive current availability and lead-time information for the XC4013E-3PQ208I.