XC4013E-3PG223I

The XC4013E-3PG223I is an AMD XC4000E/X family field-programmable gate array (FPGA) supplied in a 223-BCPGA package for through-hole mounting. It provides mid-density programmable logic and on-chip memory targeted at industrial-grade embedded designs.

With approximately 1,368 logic elements, 18,432 bits of embedded RAM and 192 user I/Os, this device is suited to applications that require moderate logic density, flexible I/O count and operation across a wide industrial temperature range.

Key Features

• Core Logic 576 logic blocks delivering approximately 1,368 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory Approximately 18,432 bits of on-chip RAM for small buffers, FIFOs or register files.
• I/O Capacity 192 user I/O pins to support parallel interfaces, control signals and external device interconnects.
• Gate Count Approximately 13,000 gates for mid-range functional integration.
• Power Single-supply operation from 4.5 V to 5.5 V, suitable for 5 V system environments.
• Package & Mounting 223-BCPGA (supplier package: 223-CPGA, 47.24 × 47.24 mm) in a through-hole mounting style for robust board attachment.
• Industrial Temperature Rated for operation from −40 °C to 100 °C, appropriate for industrial applications.
• RoHS Compliance RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• Industrial Control — Implement deterministic control logic, I/O aggregation and protocol bridging in factory automation and machine control systems.
• Embedded Systems — Provide glue logic, custom state machines and peripheral interfacing within embedded product designs.
• Communications Interfaces — Create parallel interface handlers, simple protocol converters or timing-critical glue between subsystems.
• Prototyping and Evaluation — Use the through-hole, BCPGA package and mid-density resources for board-level prototyping and hardware validation in lab environments.

Unique Advantages

• Balanced Logic Density: Approximately 1,368 logic elements and ~13,000 gates provide a mid-range integration point that simplifies designs without excessive complexity.
• Generous I/O Count: 192 user I/Os enable direct connection to multiple peripherals and buses, reducing the need for external I/O expanders.
• Integrated On-Chip RAM: 18,432 bits of embedded memory support small data buffers and control structures without external memory.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments.
• Through-Hole BCPGA Package: The 223-BCPGA, through-hole package (223-CPGA, 47.24 × 47.24 mm) provides robust mechanical attachment for harsh environments or legacy board designs.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for modern production processes.

Why Choose XC4013E-3PG223I?

The XC4013E-3PG223I positions itself as a practical mid-density FPGA option within the XC4000E/X family, combining a useful mix of logic elements, embedded RAM and a high I/O count in an industrial-temperature, through-hole BCPGA package. It is appropriate for engineers seeking dependable programmable logic for industrial control, embedded interfacing and board-level prototyping where 5 V system compatibility and rugged mounting are required.

Its combination of resources and packaging delivers a scalable building block for designs that require moderate functional integration, stable operation across a broad temperature range and straightforward board assembly using through-hole technology.

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