XC4013E-3HQ208I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 160 18432 1368 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 21 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 160 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 1368 | ||
| Number of Gates | 13000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of XC4013E-3HQ208I – XC4000E/X Field Programmable Gate Array (FPGA) IC, 160 I/O, 208-BFQFP
The XC4013E-3HQ208I is an XC4000E/X family Field Programmable Gate Array (FPGA) device from AMD designed for mid-density programmable logic tasks. It combines a balanced complement of logic resources, embedded RAM, and I/O to support custom digital functions in industrial and embedded system designs.
With a 4.5 V to 5.5 V supply range, industrial-grade qualification, and an extended operating temperature range, this surface-mount FPGA is suited for applications that require reliable operation across a wide thermal span and elevated environmental demands.
Key Features
- Logic Core — 576 logic array blocks providing 1,368 logic elements (cells) and approximately 13,000 gates for mid-density programmable logic implementation.
- Embedded Memory — Total on-chip RAM of 18,432 bits (approximately 0.0184 Mbits) for small buffers, FIFOs, and state storage.
- I/O Capacity — 160 user I/O pins to support parallel interfaces, GPIO expansion, and mixed-signal front-end connectivity.
- Power — Single supply operation from 4.5 V to 5.5 V for compatibility with legacy 5 V systems and common industrial power rails.
- Package & Mounting — 208-BFQFP exposed pad package, supplier device package 208-PQFP (28×28), designed for surface-mount assembly with exposed pad thermal support.
- Environmental & Reliability — Industrial grade with operating temperature from −40 °C to 100 °C and RoHS compliance for regulatory conformity.
Typical Applications
- Industrial Control — Implement control logic, sequencing, and I/O aggregation where extended temperature range and industrial-grade components are required.
- Embedded Systems — Provide glue logic, custom state machines, and moderate-density programmable functions in embedded appliances and instrumentation.
- Interface Bridging — Serve as a programmable interface hub to marry multiple parallel or custom I/O buses using 160 available I/O pins.
Unique Advantages
- Mid-Density Logic Resources: 1,368 logic elements and ~13,000 gates allow implementation of non-trivial custom logic without overprovisioning.
- Compact Embedded Memory: 18,432 bits of on-chip RAM provide local storage for buffering and small data structures, reducing external memory needs.
- Robust Industrial Operation: Industrial grade and −40 °C to 100 °C operating range support deployment in demanding environments.
- Legacy Power Compatibility: 4.5 V to 5.5 V supply range enables straightforward integration into 5 V-based systems and industrial power domains.
- High I/O Count: 160 I/O pins give designers flexibility for parallel buses, control signals, and peripheral interfaces.
- Surface-Mount, Exposed-Pad Package: 208-BFQFP exposed pad in a 28×28 footprint supports efficient PCB mounting and improved thermal performance.
Why Choose XC4013E-3HQ208I?
The XC4013E-3HQ208I positions itself as a practical mid-density FPGA option for engineers needing a balance of logic, memory, and I/O in an industrial-grade package. Its combination of 1,368 logic elements, 160 I/O, and a compact exposed-pad 208-BFQFP package makes it well suited to embedded and industrial control designs that operate from 4.5 V to 5.5 V and across −40 °C to 100 °C.
This device delivers deterministic, on-chip programmable logic and memory resources that can simplify board-level design, consolidate discrete logic, and shorten development cycles for teams targeting robust, long-life deployments.
Request a quote or submit an inquiry to get pricing and availability information for the XC4013E-3HQ208I.

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