XC4013E-3HQ208I

IC FPGA 160 I/O 208QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 160 18432 1368 208-BFQFP Exposed Pad

Quantity 21 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFP Exposed PadNumber of I/O160Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates13000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XC4013E-3HQ208I – XC4000E/X Field Programmable Gate Array (FPGA) IC, 160 I/O, 208-BFQFP

The XC4013E-3HQ208I is an XC4000E/X family Field Programmable Gate Array (FPGA) device from AMD designed for mid-density programmable logic tasks. It combines a balanced complement of logic resources, embedded RAM, and I/O to support custom digital functions in industrial and embedded system designs.

With a 4.5 V to 5.5 V supply range, industrial-grade qualification, and an extended operating temperature range, this surface-mount FPGA is suited for applications that require reliable operation across a wide thermal span and elevated environmental demands.

Key Features

  • Logic Core — 576 logic array blocks providing 1,368 logic elements (cells) and approximately 13,000 gates for mid-density programmable logic implementation.
  • Embedded Memory — Total on-chip RAM of 18,432 bits (approximately 0.0184 Mbits) for small buffers, FIFOs, and state storage.
  • I/O Capacity — 160 user I/O pins to support parallel interfaces, GPIO expansion, and mixed-signal front-end connectivity.
  • Power — Single supply operation from 4.5 V to 5.5 V for compatibility with legacy 5 V systems and common industrial power rails.
  • Package & Mounting — 208-BFQFP exposed pad package, supplier device package 208-PQFP (28×28), designed for surface-mount assembly with exposed pad thermal support.
  • Environmental & Reliability — Industrial grade with operating temperature from −40 °C to 100 °C and RoHS compliance for regulatory conformity.

Typical Applications

  • Industrial Control — Implement control logic, sequencing, and I/O aggregation where extended temperature range and industrial-grade components are required.
  • Embedded Systems — Provide glue logic, custom state machines, and moderate-density programmable functions in embedded appliances and instrumentation.
  • Interface Bridging — Serve as a programmable interface hub to marry multiple parallel or custom I/O buses using 160 available I/O pins.

Unique Advantages

  • Mid-Density Logic Resources: 1,368 logic elements and ~13,000 gates allow implementation of non-trivial custom logic without overprovisioning.
  • Compact Embedded Memory: 18,432 bits of on-chip RAM provide local storage for buffering and small data structures, reducing external memory needs.
  • Robust Industrial Operation: Industrial grade and −40 °C to 100 °C operating range support deployment in demanding environments.
  • Legacy Power Compatibility: 4.5 V to 5.5 V supply range enables straightforward integration into 5 V-based systems and industrial power domains.
  • High I/O Count: 160 I/O pins give designers flexibility for parallel buses, control signals, and peripheral interfaces.
  • Surface-Mount, Exposed-Pad Package: 208-BFQFP exposed pad in a 28×28 footprint supports efficient PCB mounting and improved thermal performance.

Why Choose XC4013E-3HQ208I?

The XC4013E-3HQ208I positions itself as a practical mid-density FPGA option for engineers needing a balance of logic, memory, and I/O in an industrial-grade package. Its combination of 1,368 logic elements, 160 I/O, and a compact exposed-pad 208-BFQFP package makes it well suited to embedded and industrial control designs that operate from 4.5 V to 5.5 V and across −40 °C to 100 °C.

This device delivers deterministic, on-chip programmable logic and memory resources that can simplify board-level design, consolidate discrete logic, and shorten development cycles for teams targeting robust, long-life deployments.

Request a quote or submit an inquiry to get pricing and availability information for the XC4013E-3HQ208I.

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