XC4013E-3BG225I

The XC4013E-3BG225I is an AMD XC4000E/X family Field Programmable Gate Array (FPGA) in a 225-BBGA surface-mount package. It provides a mid-range FPGA fabric with 1,368 logic elements, 576 CLBs, and 18,432 bits of on-chip RAM for implementing control, glue-logic, and embedded logic functions.

Designed for industrial temperature operation and a 4.5 V to 5.5 V supply range, this device combines a 192-pin I/O count and approximately 13,000 gates of logic capacity in a compact 225-PBGA (27×27 mm) footprint.

Key Features

• Core Logic: 1,368 logic elements and 576 CLBs (logic blocks) to implement combinational and sequential logic functions.
• On-chip Memory: 18,432 total RAM bits of embedded memory available for small FIFOs, state storage, and control data.
• I/O Capability: 192 user I/O pins to support multiple interfaces and peripheral connections from a single device.
• Gate Capacity: Approximately 13,000 gates providing integration for mid-complexity designs.
• Package and Mounting: 225-BBGA surface-mount package; supplier device package specified as 225-PBGA (27×27 mm) for compact, board-level integration.
• Power: 4.5 V to 5.5 V supply range suitable for standard 5 V systems.
• Industrial Temperature Grade: Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliant: Environmentally compliant with RoHS requirements.

Typical Applications

• Industrial Control: Implement control logic, state machines, and interface bridging where industrial temperature range and robust I/O counts are required.
• Embedded Glue Logic: Replace discrete glue components by consolidating logic functions using the device’s 1,368 logic elements and 192 I/Os.
• Prototyping and Development: Use the on-chip RAM and CLB resources to prototype custom logic blocks and verify system-level behavior before final ASIC decisions.

Unique Advantages

• Balanced Logic and Memory: The combination of 1,368 logic elements and 18,432 RAM bits supports moderate-density designs that require both logic and small embedded memories.
• High I/O Count in a Compact Package: 192 I/Os in a 225-BBGA (27×27 mm) footprint reduces board space while enabling multiple peripheral connections.
• Industrial Temperature Range: Rated −40 °C to 100 °C for reliable operation in outdoor and industrial environments.
• Standard 5 V Supply Compatibility: Operates from 4.5 V to 5.5 V, facilitating integration into existing 5 V-based systems.
• RoHS Compliant: Conforms to RoHS for environmentally conscious designs and manufacturing.

Why Choose XC4013E-3BG225I?

The XC4013E-3BG225I delivers a practical balance of logic capacity, on-chip memory, and I/O density in a compact 225-BBGA package, tailored for mid-complexity FPGA tasks in industrial environments. Its industrial temperature rating and standard 5 V supply range make it a straightforward choice for designers consolidating control, interfacing, or prototyping functions onto a single programmable device.

This part suits engineering teams and procurement groups looking for a reliable, RoHS-compliant FPGA option that provides moderate gate density and ample I/O without a large package footprint, enabling scalable designs and simplified board-level integration.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC4013E-3BG225I.