XC4013E-3HQ208C

The XC4013E-3HQ208C is an AMD XC4000E/X Field Programmable Gate Array (FPGA) packaged in a 208-BFQFP with exposed pad for surface-mount assembly. It provides a mid-range combination of logic capacity, on-chip memory, and I/O suitable for commercial-grade embedded designs.

Key architectural characteristics include approximately 1,368 logic elements, roughly 18,432 bits of embedded RAM, and 160 general-purpose I/O pins. The device operates from a 4.75 V to 5.25 V supply and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 1,368 logic elements enabling flexible implementation of combinational and sequential logic functions within a single FPGA.
• On-Chip Memory  Approximately 18,432 bits of embedded RAM to support local data buffering, state storage, and small lookup tables.
• I/O Capacity  160 general-purpose I/O pins for interfacing with external devices and peripherals.
• Gate Equivalence  Approximately 13,000 gates of logic equivalence for estimating integration density and partitioning functions.
• Power  Single-supply operation from 4.75 V to 5.25 V, compatible with standard 5 V system rails.
• Package & Mounting  208-BFQFP with exposed pad (supplier package: 208-PQFP, 28×28); surface-mount mounting type for PCB integration.
• Commercial Grade  Specified operating temperature range of 0 °C to 85 °C suitable for commercial applications.
• Regulatory  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Use the FPGA’s logic capacity and I/O count to implement custom control and interface functions in 5 V commercial electronics.
• Prototyping and Evaluation  Leverage the device’s on-chip RAM and logic resources for proof-of-concept designs and early-stage development.
• I/O-Intensive Control  Deploy the 160 I/O pins for handling multiple sensors, actuators, or peripheral interfaces in compact designs.

Unique Advantages

• Balanced Logic and Memory:  Approximately 1,368 logic elements paired with ~18,432 bits of embedded RAM supports a mix of control logic and local data storage without external memory.
• Substantial I/O in a Single Package:  160 I/O pins reduce the need for external I/O expanders and simplify board-level routing for multi-signal designs.
• 5 V System Compatibility:  Native 4.75 V–5.25 V supply range aligns with common 5 V commercial platforms for straightforward power integration.
• Compact Surface-Mount Package:  208-BFQFP exposed pad and surface-mount form factor enable dense PCB layouts while supporting standard assembly processes.
• Commercial Temperature Range:  Specified 0 °C–85 °C operation matches commercial-grade product requirements.
• RoHS Compliant:  Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Why Choose XC4013E-3HQ208C?

The XC4013E-3HQ208C delivers a practical mix of logic capacity, embedded RAM, and extensive I/O in a commercial-grade FPGA package. Its approximately 1,368 logic elements, ~18,432 bits of on-chip memory, and 160 I/O pins make it suitable for compact, 5 V embedded designs that require moderate logic density and flexible interfacing.

Engineers and procurement teams looking for a RoHS-compliant, surface-mount FPGA with a 208-BFQFP exposed pad package and defined commercial temperature and voltage ranges will find the XC4013E-3HQ208C a well-specified option for mid-range FPGA integration.

Request a quote or submit an inquiry for pricing and availability of the XC4013E-3HQ208C to begin integrating this FPGA into your next commercial embedded design.