XC4013E-3BG225C

The XC4013E-3BG225C is a commercial-grade Field Programmable Gate Array (FPGA) IC from AMD, offered in a 225-ball BGA package. It provides moderate on-chip logic and memory resources together with a 192-pin I/O count for applications that require configurable digital logic and flexible interfacing.

Designed for surface-mount mounting and operation on a 4.75 V to 5.25 V supply, the device targets systems operating in standard commercial temperature environments (0 °C to 85 °C) while meeting RoHS environmental requirements.

Key Features

• Logic Capacity  Approximately 1,368 logic elements to implement combinational and sequential logic functions for mid-complexity designs.
• Configurable Logic Blocks  576 configurable logic blocks (CLBs) to structure designs and partition logic effectively within the device.
• Embedded Memory  Approximately 18,432 bits of on-chip RAM to support buffering, small lookup tables, and local data storage.
• I/O Density  192 user I/O pins to support multiple interfaces, parallel buses, and mixed-signal front-end connections when paired with external components.
• Gate Count  About 13,000 gates for estimating implementation capacity and resource planning.
• Package & Mounting  225-ball PBGA package (27 × 27 mm) in a surface-mount form factor for compact board layouts.
• Power & Operating Range  Single-supply operation from 4.75 V to 5.25 V; specified commercial operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet standard environmental requirements for lead-free assembly.

Typical Applications

• Interface Bridging  Use the device's 192 I/O pins to implement protocol conversion and bus bridging between parallel and serial subsystems.
• Control Logic  Implement custom finite-state machines, timing control, and glue logic for embedded systems requiring reconfigurable control paths.
• Prototyping and Development  Deploy as a development FPGA for validating logic functions and small-scale system prototypes before final implementation.
• Peripheral Aggregation  Aggregate and manage multiple peripheral signals with on-chip logic and local RAM for buffering and sequencing tasks.

Unique Advantages

• Balanced logic and memory resources: With roughly 1,368 logic elements and 18,432 bits of embedded RAM, the device supports a mix of logic functions and localized data storage without external memory for small data tasks.
• High I/O count for flexible interfacing: 192 I/Os enable connections to multiple peripherals and external devices, reducing the need for additional IO expanders.
• Standard 5 V operation: Compatibility with 5 V supply rails simplifies integration into existing commercial systems that use this common voltage domain.
• Compact BGA footprint: The 225-ball PBGA (27 × 27 mm) package offers a high pin-count in a compact surface-mount package suitable for space-constrained PCBs.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation, appropriate for a wide range of non-industrial embedded applications.
• RoHS compliant: Meets lead-free environmental requirements for modern assembly processes.

Why Choose XC4013E-3BG225C?

The XC4013E-3BG225C is positioned as a mid-range FPGA solution that combines moderate logic capacity, embedded RAM, and a high I/O count in a compact PBGA package. Its single 5 V supply requirement and commercial temperature rating make it suitable for designers building reconfigurable control, interfacing, and prototyping solutions for standard commercial products.

For teams needing a RoHS-compliant, surface-mount FPGA with a balance of logic, memory, and I/O capability, this part provides a practical option that aligns with conservative power and thermal constraints while simplifying board-level integration.

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