XC4013E-3HQ240C

IC FPGA 192 I/O 240QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP Exposed Pad

Quantity 923 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O192Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates13000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XC4013E-3HQ240C – XC4000E/X FPGA, 1368 Logic Elements, 240-BFQFP

The XC4013E-3HQ240C is a field programmable gate array (FPGA) device from AMD’s XC4000E/X family, delivered in a 240-BFQFP exposed-pad package. It provides a mid-density programmable logic platform combining 576 CLBs (configurable logic blocks) and 1,368 logic elements alongside on-chip memory and extensive I/O to address a range of commercial embedded applications.

Designed for 5 V systems with a 4.75 V to 5.25 V supply range and commercial operating temperature, this surface-mount FPGA targets applications requiring moderate logic capacity, flexible I/O routing and on-chip RAM for control, interfacing and glue-logic functions.

Key Features

  • Core Logic  576 CLBs providing a total of 1,368 logic elements for implementing combinational and sequential logic functions.
  • Embedded Memory  18,432 bits of on-chip RAM (approximately 0.018 Mbits) for small-data buffering, state storage and micro-coded functions.
  • I/O Capacity  192 user I/O pins to support parallel interfaces, peripheral control and board-level signal routing.
  • Logic Density  Approximately 13,000 gates of equivalent logic capacity for mid-range digital designs.
  • Power and Voltage  Operates from a 4.75 V to 5.25 V supply to match standard 5 V system domains.
  • Package and Mounting  240-BFQFP exposed pad package (supplier device package: 240-PQFP 32×32) in a surface-mount form factor for compact PCB integration and thermal contact.
  • Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliant for environmental regulatory alignment.

Typical Applications

  • Embedded System Control  Implement control logic, state machines and timing-critical glue logic for commercial embedded products.
  • Interface Bridging  Provide protocol translation and parallel/serial interfacing where moderate I/O and programmable logic are required.
  • Prototyping and Development  Use as a mid-density FPGA platform for hardware validation, proof-of-concept designs and feature evaluation.
  • Consumer and Industrial Electronics  Drive custom peripheral control, user-interface logic and on-board data handling within commercial temperature ranges.

Unique Advantages

  • Balanced Logic and I/O Count: Combines 1,368 logic elements with 192 I/Os to support designs that need both moderate compute and broad connectivity.
  • On‑chip Memory for Local Data: 18,432 bits of embedded RAM reduce the need for external memory for small buffers and state storage.
  • Standard 5 V Supply Compatibility: Operation from 4.75 V to 5.25 V simplifies integration into existing 5 V system architectures.
  • Compact Surface‑Mount Packaging: 240-BFQFP exposed-pad package allows space-efficient board layouts and provides a thermal contact point for heat dissipation.
  • RoHS Compliant: Meets environmental compliance requirements for lead-free assembly and material restrictions.

Why Choose XC4013E-3HQ240C?

The XC4013E-3HQ240C delivers a pragmatic combination of logic capacity, I/O density and on-chip memory in a commercially graded FPGA package suitable for a wide range of embedded and interfacing tasks. Its 576 CLBs and 1,368 logic elements make it well suited for designers who need a flexible programmable device without excess density.

From prototyping to production in commercial-temperature applications, this AMD FPGA offers a compact, surface-mount solution that balances integration and system-level flexibility while meeting RoHS requirements.

Request a quote or submit a purchasing inquiry to obtain pricing and availability for the XC4013E-3HQ240C. Our team will respond with detailed ordering and lead-time information.

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