XC4013E-3HQ240I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 160 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 192 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 1368 | ||
| Number of Gates | 13000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of XC4013E-3HQ240I – XC4000E/X FPGA, 1368 Logic Elements, 192 I/O, 240-BFQFP
The XC4013E-3HQ240I is a Field Programmable Gate Array (FPGA) from AMD’s XC4000E/X family, designed for industrial-grade embedded applications. It delivers reconfigurable logic capacity with on-chip RAM and a substantial I/O count, making it suitable for designs that require flexible digital logic, interface integration, and robust operating range.
With 1,368 logic elements, 18,432 bits of on-chip RAM, and 192 user I/O pins in a 240-BFQFP exposed-pad package, this device targets industrial systems where integration, thermal performance, and a 4.5 V to 5.5 V supply window are important design constraints.
Key Features
- Core Logic Approximately 1,368 logic elements provide a moderate level of programmable logic resources for combinational and sequential designs.
- Embedded Memory 18,432 bits of on-chip RAM (approximately 0.018 Mbits) for small buffers, FIFOs, and state storage without external memory.
- I/O and Gate Count 192 user I/O pins and an estimated 13,000 gates support multi-channel interfacing and glue-logic integration.
- Power and Voltage Operates from a 4.5 V to 5.5 V supply range, compatible with standard 5 V industrial systems.
- Thermal and Grade Industrial temperature range from -40 °C to 100 °C for deployment in demanding environments.
- Package & Mounting 240-BFQFP exposed pad package (supplier device package: 240-PQFP 32×32) in a surface-mount format for PCB integration and thermal management.
- Compliance RoHS compliant, meeting lead-free environmental requirements.
Typical Applications
- Industrial Automation Implement custom control logic, timing, and interfacing tasks in PLCs, motor controllers, and factory automation equipment.
- Embedded Control Serve as a reconfigurable control element for embedded platforms that require flexible digital logic and multiple I/O channels.
- Instrumentation & Measurement Provide data conditioning, protocol bridging, and timing functions in test equipment and measurement systems.
- Communications Interfaces Implement interface logic, protocol glue, and buffering for serial and parallel peripheral connections.
Unique Advantages
- Balanced Logic and Memory: 1,368 logic elements combined with 18,432 bits of on-chip RAM offer a compact programmable solution for a range of medium-complexity functions without external memory.
- High I/O Count: 192 I/O pins enable dense peripheral and bus interfacing, reducing the need for additional interface chips.
- Industrial Temperature Rating: Rated from -40 °C to 100 °C, the device supports deployment in temperature-challenging environments commonly found in industrial systems.
- Package Designed for Thermal Performance: 240-BFQFP with exposed pad and surface-mount mounting facilitates PCB-level thermal dissipation and reliable solder mounting.
- 5 V Supply Compatibility: Operates across a 4.5 V to 5.5 V range, aligning with legacy and industrial 5 V power rails for straightforward integration.
- RoHS Compliant: Meets environmental restriction requirements for lead-free manufacturing and assembly.
Why Choose XC4013E-3HQ240I?
The XC4013E-3HQ240I positions itself as a practical, industrial-grade FPGA option when moderate logic density, ample I/O, and on-chip RAM are required in a single device. Its voltage range, temperature rating, and exposed-pad BFQFP package make it suitable for embedded and industrial designs that prioritize integration and thermal management.
This device is well suited for engineering teams and procurement groups seeking a reconfigurable logic component that balances resource count and environmental robustness, offering clear integration benefits for mid-complexity digital designs.
Request a quote or submit an inquiry to receive pricing and availability for the XC4013E-3HQ240I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








