XC4013E-3HQ240I

IC FPGA 192 I/O 240QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP Exposed Pad

Quantity 160 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFP Exposed PadNumber of I/O192Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates13000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XC4013E-3HQ240I – XC4000E/X FPGA, 1368 Logic Elements, 192 I/O, 240-BFQFP

The XC4013E-3HQ240I is a Field Programmable Gate Array (FPGA) from AMD’s XC4000E/X family, designed for industrial-grade embedded applications. It delivers reconfigurable logic capacity with on-chip RAM and a substantial I/O count, making it suitable for designs that require flexible digital logic, interface integration, and robust operating range.

With 1,368 logic elements, 18,432 bits of on-chip RAM, and 192 user I/O pins in a 240-BFQFP exposed-pad package, this device targets industrial systems where integration, thermal performance, and a 4.5 V to 5.5 V supply window are important design constraints.

Key Features

  • Core Logic  Approximately 1,368 logic elements provide a moderate level of programmable logic resources for combinational and sequential designs.
  • Embedded Memory  18,432 bits of on-chip RAM (approximately 0.018 Mbits) for small buffers, FIFOs, and state storage without external memory.
  • I/O and Gate Count  192 user I/O pins and an estimated 13,000 gates support multi-channel interfacing and glue-logic integration.
  • Power and Voltage  Operates from a 4.5 V to 5.5 V supply range, compatible with standard 5 V industrial systems.
  • Thermal and Grade  Industrial temperature range from -40 °C to 100 °C for deployment in demanding environments.
  • Package & Mounting  240-BFQFP exposed pad package (supplier device package: 240-PQFP 32×32) in a surface-mount format for PCB integration and thermal management.
  • Compliance  RoHS compliant, meeting lead-free environmental requirements.

Typical Applications

  • Industrial Automation  Implement custom control logic, timing, and interfacing tasks in PLCs, motor controllers, and factory automation equipment.
  • Embedded Control  Serve as a reconfigurable control element for embedded platforms that require flexible digital logic and multiple I/O channels.
  • Instrumentation & Measurement  Provide data conditioning, protocol bridging, and timing functions in test equipment and measurement systems.
  • Communications Interfaces  Implement interface logic, protocol glue, and buffering for serial and parallel peripheral connections.

Unique Advantages

  • Balanced Logic and Memory:  1,368 logic elements combined with 18,432 bits of on-chip RAM offer a compact programmable solution for a range of medium-complexity functions without external memory.
  • High I/O Count:  192 I/O pins enable dense peripheral and bus interfacing, reducing the need for additional interface chips.
  • Industrial Temperature Rating:  Rated from -40 °C to 100 °C, the device supports deployment in temperature-challenging environments commonly found in industrial systems.
  • Package Designed for Thermal Performance:  240-BFQFP with exposed pad and surface-mount mounting facilitates PCB-level thermal dissipation and reliable solder mounting.
  • 5 V Supply Compatibility:  Operates across a 4.5 V to 5.5 V range, aligning with legacy and industrial 5 V power rails for straightforward integration.
  • RoHS Compliant:  Meets environmental restriction requirements for lead-free manufacturing and assembly.

Why Choose XC4013E-3HQ240I?

The XC4013E-3HQ240I positions itself as a practical, industrial-grade FPGA option when moderate logic density, ample I/O, and on-chip RAM are required in a single device. Its voltage range, temperature rating, and exposed-pad BFQFP package make it suitable for embedded and industrial designs that prioritize integration and thermal management.

This device is well suited for engineering teams and procurement groups seeking a reconfigurable logic component that balances resource count and environmental robustness, offering clear integration benefits for mid-complexity digital designs.

Request a quote or submit an inquiry to receive pricing and availability for the XC4013E-3HQ240I.

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