XC4013XL-3BG256C

The XC4013XL-3BG256C is a commercial-grade FPGA offering reprogrammable logic resources in a compact 256-ball BGA package. It provides 1,368 logic elements, 18,432 bits of on-chip RAM, and 192 general-purpose I/O pins to support custom digital functions in space-constrained systems.

Designed for applications requiring moderate gate count and flexible I/O routing, this device operates from a 3.0 V to 3.6 V supply and is specified for 0 °C to 85 °C operation. RoHS compliance simplifies integration into modern product designs.

Key Features

• Logic Capacity — 1,368 logic elements and an estimated 13,000 gates provide moderate implementation density for custom digital logic and glue-logic functions.
• On-Chip Memory — 18,432 total RAM bits (approximately 0.018 Mbits) for small data buffers, state machines, and temporary storage without external memory.
• I/O Count — 192 I/O pins to interface with sensors, peripherals, and external buses while supporting parallel and serial signaling topologies.
• Package & Mounting — 256-ball BGA (supplier package 256-PBGA, 27 × 27 mm) with surface-mount mounting type for high-density board layouts.
• Power — Single-supply operation from 3.0 V to 3.6 V suitable for common system power rails.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant to meet modern lead-free assembly requirements.

Typical Applications

• Embedded Control — Implement custom control logic and finite-state machines for embedded products that require moderate logic density and multiple I/O.
• Peripheral Interface — Bridge and adapt signals between different subsystems using the device’s 192 I/O pins for parallel and serial interfacing.
• Prototyping and Development — Evaluate custom digital functions and validate designs that need reprogrammable logic and on-chip RAM before final integration.
• User Interface Control — Manage key scanning, display driving, and input aggregation where a compact BGA package and moderate logic resources are sufficient.

Unique Advantages

• Moderate Logic Density: 1,368 logic elements and ~13,000 gates accommodate a wide range of custom logic tasks without excess complexity.
• Integrated Memory: 18,432 bits of on-chip RAM reduce the need for external memory in small buffering and state storage applications.
• High I/O Count in a Compact Footprint: 192 I/Os in a 256-ball BGA (27 × 27 mm) enable dense board layouts while preserving extensive connectivity.
• Standard Power Envelope: 3.0 V to 3.6 V supply range aligns with common system rails for straightforward power design.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet typical consumer and commercial product requirements.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose XC4013XL-3BG256C?

The XC4013XL-3BG256C is positioned for engineers seeking a reprogrammable, moderately sized FPGA that balances logic capacity, on-chip memory, and I/O density in a compact BGA package. Its combination of 1,368 logic elements, 18,432 bits of RAM, and 192 I/Os makes it suitable for embedded control, signal interfacing, and prototyping tasks where commercial-grade temperature limits and standard supply voltages apply.

Choose this device when your design requires flexible digital implementation within a constrained board area and you value RoHS compliance and a proven package format for surface-mount assembly.

Request a quote or submit a procurement inquiry to evaluate the XC4013XL-3BG256C for your next design.