XC4013XL-3BG256I

The XC4013XL-3BG256I is a field programmable gate array (FPGA) IC from AMD belonging to the XC4000E/X family. It combines configurable logic resources, on‑chip RAM, and a 192‑pin I/O footprint in a 256‑ball BGA package for designs that require flexible digital logic and I/O expansion within industrial temperature ranges.

This device is targeted at applications that need deterministic logic capacity, a moderate amount of embedded memory, and robust electrical and environmental operating parameters, including surface‑mount PCB assembly and RoHS compliance.

Key Features

• Configurable Logic: 576 configurable logic blocks (CLBs) and 1,368 logic element cells provide the core programmable resources for implementing custom digital functions.
• Embedded Memory: Total on‑chip RAM of 18,432 bits supports small look‑up tables, FIFOs, and buffering needs directly in the FPGA fabric.
• I/O Capacity: 192 user I/O pins suitable for interfacing to multiple peripherals, GPIO, and parallel buses in system designs.
• Logic Scale: Approximately 13,000 equivalent gates available for glue logic, protocol handling, and control functions.
• Power Supply: Single supply operation from 3 V to 3.6 V simplifies power rail selection for many board designs.
• Package and Mounting: Surface mount in a 256‑BBGA package (supplier device package: 256‑PBGA, 27×27 mm) for compact board integration.
• Industrial Temperature Range: Rated for operation from −40 °C to 100 °C, addressing industrial and other temperature‑challenging environments.
• RoHS Compliant: Conforms to RoHS requirements for lead‑free manufacturing processes.

Typical Applications

• Industrial Control: Implement custom control logic and I/O aggregation where extended temperature range and robust I/O are required.
• Embedded Logic and Glue: Replace discrete glue logic with programmable logic to consolidate functions and simplify board layouts.
• Data Routing and Buffering: Use on‑chip RAM and extensive I/O to implement small buffers, FIFOs, or protocol adaptation between subsystems.

Unique Advantages

• Balanced Logic and Memory: The combination of 1,368 logic element cells and 18,432 bits of RAM allows implementation of mixed logic and memory functions without external SRAM for many use cases.
• Generous I/O Count: 192 I/O pins enable connectivity to multiple peripherals and parallel interfaces, reducing the need for external expanders.
• Industrial‑Grade Operation: −40 °C to 100 °C operating range supports deployments in temperature‑sensitive environments.
• Compact Ball‑Grid Packaging: 256‑BBGA (256‑PBGA supplier package, 27×27 mm) provides a high pin count in a compact footprint for space‑constrained designs.
• Simplified Power Requirements: Single supply range of 3 V to 3.6 V eases power supply design and integration.
• RoHS Compliance: Supports lead‑free manufacturing requirements and supply‑chain compliance.

Why Choose XC4013XL-3BG256I?

The XC4013XL-3BG256I delivers a practical balance of programmable logic, on‑chip RAM, and I/O density in a package and temperature rating aligned with industrial applications. Its mix of 576 CLBs (1,368 logic element cells), 18,432 bits of embedded RAM, and 192 I/O pins makes it well suited for engineers looking to consolidate discrete logic, implement protocol bridging, or add custom control functions without excessive board area.

This device is appropriate for design teams that require a surface‑mount, RoHS‑compliant FPGA with defined environmental and power specifications. Its package, thermal range, and electrical characteristics support longer product lifecycles in demanding environments while enabling scalable, reprogrammable implementations.

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