XC4028XL-3BG256C

The XC4028XL-3BG256C is an AMD XC4000E/X family Field Programmable Gate Array (FPGA) supplied in a 256-ball BGA package. It provides programmable logic resources, embedded RAM, and a high I/O count in a commercial-grade surface-mount package.

This device is suited for commercial embedded designs that require flexible, reconfigurable logic, multiple I/O connections, and on-chip memory while operating within a 0 °C to 85 °C temperature range and a 3.0 V to 3.6 V supply window.

Key Features

• Core Logic  2,432 logic elements provide the programmable combinational and sequential resources for implementing custom logic functions.
• Embedded Memory  32,768 bits of on-chip RAM (approximately 32 Kbits) for local storage, buffering, and state retention within user designs.
• I/O Density  205 user I/O pins support a wide range of external interfaces and board-level connectivity.
• Gate Count  Approximately 28,000 gates to support medium-complexity logic implementations.
• Package & Mounting  256-ball BGA (supplier package: 256-PBGA, 27 × 27 mm) in a surface-mount form factor for compact board integration.
• Power  Operates from a 3.0 V to 3.6 V supply, enabling compatibility with common commercial power rails.
• Operating Range  Commercial temperature grade rated from 0 °C to 85 °C for typical commercial embedded environments.
• Compliance  RoHS-compliant material construction supports regulatory requirements for lead-free assembly.

Typical Applications

• Commercial Embedded Systems  Implement custom logic and control functions where moderate logic density and on-chip RAM are required within a commercial temperature range.
• Board-level Prototyping  Use as a reprogrammable platform for validating digital designs and interface logic with its 205 I/O pins and surface-mount BGA package.
• Interface Bridging  Provide glue-logic and protocol adaptation between subsystems, leveraging the device’s I/O count and programmable logic capacity.

Unique Advantages

• High I/O Count: 205 user I/O pins enable complex interconnections and multiple peripheral interfaces without external multiplexing.
• Balanced Logic and Memory: 2,432 logic elements paired with approximately 32 Kbits of RAM support mid-range logic implementations with local data storage.
• Compact BGA Package: The 256-ball BGA (27 × 27 mm) conserves board area while supporting surface-mount assembly processes.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match typical commercial deployment environments and product lifecycles.
• RoHS Compliance: Environmentally compliant construction simplifies regulatory handling for lead-free assemblies.

Why Choose XC4028XL-3BG256C?

The XC4028XL-3BG256C provides a practical combination of programmable logic, on-chip memory, and high I/O density in a compact 256-BBGA surface-mount package. Its commercial temperature rating and 3.0 V–3.6 V supply compatibility make it suitable for a wide range of commercial embedded designs that require reconfigurable logic without excessive board footprint.

This device is a fit for design teams seeking a medium-complexity FPGA solution that balances logic capacity, embedded RAM, and connectivity while maintaining RoHS compliance and standard commercial operating parameters.

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