XC4028XL-3BG256I

IC FPGA 205 I/O 256BGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 205 32768 2432 256-BBGA

Quantity 798 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BBGANumber of I/O205Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1024Number of Logic Elements/Cells2432
Number of Gates28000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XC4028XL-3BG256I – XC4000E/X Field Programmable Gate Array (FPGA) IC 205 32768 2432 256-BBGA

The XC4028XL-3BG256I is an AMD XC4000E/X series Field Programmable Gate Array (FPGA) supplied in a 256-BBGA surface-mount package. It provides a balanced set of on-chip resources including logic elements, embedded RAM, and a high I/O count for programmable digital designs.

Key device specifications include 2,432 logic elements, approximately 32,768 bits of on-chip RAM, 205 I/O pins, approximately 28,000 gates, a 3.0–3.6 V supply range, and an industrial operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

  • Core Logic  2,432 logic elements providing approximately 28,000 gates of programmable logic for implementing custom digital functions.
  • Embedded Memory  Approximately 32,768 bits of on-chip RAM for data buffering, lookup tables, and small memory structures.
  • I/O Density  205 user I/O pins to support multiple parallel interfaces and system connections.
  • Packaging & Mounting  256-BBGA package with supplier device package 256-PBGA (27×27) in a surface-mount form factor for compact PCB integration.
  • Power  Operates from 3.0 V to 3.6 V to align with common digital power rails.
  • Temperature Range  Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance  RoHS compliant material declaration for regulatory alignment.

Unique Advantages

  • High integration: Combines logic, embedded RAM and a large I/O count in a single device to reduce board-level components and simplify system design.
  • Compact package: 256-PBGA (27×27) surface-mount package enables dense PCB layouts and space-constrained applications.
  • Industrial operation: Rated for −40 °C to 100 °C, supporting deployment in industrial environments where extended temperature range is required.
  • Straightforward power requirements: 3.0–3.6 V supply range aligns with standard system rails for easier power supply design.
  • Regulatory readiness: RoHS compliance reduces material handling and end-product compliance concerns.

Why Choose XC4028XL-3BG256I?

XC4028XL-3BG256I is positioned as a mid-density FPGA in the XC4000E/X family that delivers a practical mix of programmable logic, on-chip memory, and extensive I/O in a compact BGA package. Its electrical and environmental specifications make it suitable for industrial electronic designs that require integrated logic and memory while retaining a modest footprint.

The device is well suited to designers and procurement teams seeking a RoHS-compliant, industrial-temperature FPGA option with a clear set of resources—logic elements, embedded RAM, and I/O count—that can simplify system architecture and reduce external component count.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for XC4028XL-3BG256I.

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