XC4028XL-3BG256I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 205 32768 2432 256-BBGA |
|---|---|
| Quantity | 798 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 205 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1024 | Number of Logic Elements/Cells | 2432 | ||
| Number of Gates | 28000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32768 |
Overview of XC4028XL-3BG256I – XC4000E/X Field Programmable Gate Array (FPGA) IC 205 32768 2432 256-BBGA
The XC4028XL-3BG256I is an AMD XC4000E/X series Field Programmable Gate Array (FPGA) supplied in a 256-BBGA surface-mount package. It provides a balanced set of on-chip resources including logic elements, embedded RAM, and a high I/O count for programmable digital designs.
Key device specifications include 2,432 logic elements, approximately 32,768 bits of on-chip RAM, 205 I/O pins, approximately 28,000 gates, a 3.0–3.6 V supply range, and an industrial operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.
Key Features
- Core Logic 2,432 logic elements providing approximately 28,000 gates of programmable logic for implementing custom digital functions.
- Embedded Memory Approximately 32,768 bits of on-chip RAM for data buffering, lookup tables, and small memory structures.
- I/O Density 205 user I/O pins to support multiple parallel interfaces and system connections.
- Packaging & Mounting 256-BBGA package with supplier device package 256-PBGA (27×27) in a surface-mount form factor for compact PCB integration.
- Power Operates from 3.0 V to 3.6 V to align with common digital power rails.
- Temperature Range Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant material declaration for regulatory alignment.
Unique Advantages
- High integration: Combines logic, embedded RAM and a large I/O count in a single device to reduce board-level components and simplify system design.
- Compact package: 256-PBGA (27×27) surface-mount package enables dense PCB layouts and space-constrained applications.
- Industrial operation: Rated for −40 °C to 100 °C, supporting deployment in industrial environments where extended temperature range is required.
- Straightforward power requirements: 3.0–3.6 V supply range aligns with standard system rails for easier power supply design.
- Regulatory readiness: RoHS compliance reduces material handling and end-product compliance concerns.
Why Choose XC4028XL-3BG256I?
XC4028XL-3BG256I is positioned as a mid-density FPGA in the XC4000E/X family that delivers a practical mix of programmable logic, on-chip memory, and extensive I/O in a compact BGA package. Its electrical and environmental specifications make it suitable for industrial electronic designs that require integrated logic and memory while retaining a modest footprint.
The device is well suited to designers and procurement teams seeking a RoHS-compliant, industrial-temperature FPGA option with a clear set of resources—logic elements, embedded RAM, and I/O count—that can simplify system architecture and reduce external component count.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for XC4028XL-3BG256I.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








