XC4028XL-3BG352C

IC FPGA 256 I/O 352MBGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 256 32768 2432 352-LBGA Exposed Pad, Metal

Quantity 896 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O256Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1024Number of Logic Elements/Cells2432
Number of Gates28000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of XC4028XL-3BG352C – XC4000E/X Field Programmable Gate Array (FPGA) IC

The XC4028XL-3BG352C is a field programmable gate array (FPGA) IC from AMD in the XC4000E/X family. It provides mid-range programmable logic with a balance of logic resources, on-chip memory, and I/O count for commercial embedded designs.

Key device attributes include 2,432 logic elements, 32,768 bits of embedded RAM, 256 I/O pins, approximately 28,000 gates, a 352-ball LBGA exposed-pad metal package, a 3.0–3.6 V supply range, and a commercial operating temperature range of 0 °C to 85 °C. The device is surface-mount and RoHS compliant.

Key Features

  • Core Logic  2,432 logic elements provide programmable combinational and sequential resources for implementing custom logic functions.
  • Embedded Memory  32,768 bits of on-chip RAM support local storage and buffering needs for control and data-path functions.
  • I/O Density  256 general-purpose I/O pins allow connection to multiple peripherals, buses, and external logic blocks.
  • Logic Scale  Approximately 28,000 gates for mid-range integration of digital functions.
  • Power  Operates from a 3.0 V to 3.6 V supply range, suitable for common system power rails.
  • Package & Mounting  352-LBGA exposed pad, metal package (supplier device package listed as 352-MBGA, 35×35) in a surface-mount form factor for compact PCB integration.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial environments.
  • Regulatory  RoHS compliant, supporting lead-free assembly and environmental regulations.

Unique Advantages

  • High logical integration: 2,432 logic elements enable implementation of moderate-complexity digital designs without external glue logic.
  • On-chip memory for local buffering: 32,768 bits of embedded RAM reduce dependence on external memory for control and small data-storage needs.
  • Ample I/O count: 256 I/Os support multi-channel interfaces and parallel connectivity to peripherals and sensors.
  • Compact, manufacturable package: 352-ball LBGA exposed-pad package in a 35×35 supplier footprint supports dense PCB layouts and surface-mount assembly.
  • Standard supply compatibility: 3.0–3.6 V operating range aligns with common commercial power rails for straightforward system integration.
  • RoHS compliance: Meets environmental regulations for lead-free processes and greener product designs.

Why Choose XC4028XL-3BG352C?

The XC4028XL-3BG352C positions itself as a mid-range, commercial-grade FPGA option that combines a practical count of logic elements and embedded RAM with a high I/O density and a compact LBGA package. It is suitable for designers seeking moderate logic integration and local memory in a surface-mount form factor with RoHS compliance.

With a defined supply voltage window and commercial operating temperature range, this device fits applications that require predictable electrical and thermal characteristics in standard commercial environments. Its package and pin count support compact system designs where board space and I/O routing are considerations.

Request a quote or submit an inquiry for availability and pricing of XC4028XL-3BG352C to receive detailed ordering and lead-time information.

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