XC4044XL-09BG352C

The XC4044XL-09BG352C is a commercial-grade field programmable gate array (FPGA) from AMD in the XC4000E/X family. It delivers mid-range logic capacity with substantial I/O and embedded memory in a surface-mount 352-LBGA metal package with exposed pad.

Designed for commercial applications that require configurable logic, the device provides a balance of logic resources, on‑chip RAM and I/O density while operating from a 3 V to 3.6 V supply and within a 0 °C to 85 °C temperature range.

Key Features

• Core Logic Capacity — Approximately 3,800 logic elements supporting up to 44,000 equivalent gates for medium-complexity custom logic and control functions.
• Embedded Memory — Approximately 51,200 bits of on-chip RAM to support FIFOs, small buffers and state storage without external memory.
• I/O Density — 289 general-purpose I/O pins to accommodate multiple interfaces, peripherals and parallel connections.
• Power — Single-supply operation from 3 V to 3.6 V for compatibility with common commercial power rails.
• Package & Mounting — 352-LBGA exposed pad, metal package (supplier package: 352-MBGA, 35×35) optimized for surface-mount assembly.
• Operating Range — Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded Control — Implement control logic and state machines that leverage approximately 3,800 logic elements and on-chip RAM for compact, programmable solutions.
• I/O Expansion and Interface Bridging — Use the 289 I/O pins to translate, buffer or aggregate signals between multiple peripherals and subsystems.
• Prototyping and Medium-Complexity Digital Systems — Suitable for development and deployment of medium-complexity digital designs requiring configurable logic and internal memory.

Unique Advantages

• Balanced Logic and Memory — The combination of ~3,800 logic elements and ~51,200 bits of embedded RAM supports a wide range of mid-size designs without immediate need for external memory.
• High I/O Count — 289 I/O pins enable dense peripheral integration and flexible interfacing options, reducing the need for external I/O expanders.
• Commercial-Grade Availability — Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
• Robust Package for Surface Mount — The 352-LBGA exposed pad metal package supports reliable PCB mounting and thermal contact for typical commercial board assemblies.
• Single-Supply Simplicity — Operates from a 3 V to 3.6 V supply, simplifying power-rail design in many commercial systems.

Why Choose XC4044XL-09BG352C?

The XC4044XL-09BG352C provides a mid-range, configurable logic solution from AMD that combines meaningful logic density, substantial I/O and on‑chip RAM in a compact 352-LBGA package. Its electrical and thermal operating ranges are aligned with commercial application needs, making it suitable for designers looking to implement programmable glue logic, interface controllers and medium-complexity digital functions.

For teams balancing integration, I/O requirements and board-level packaging, this FPGA offers a clear set of verifiable capabilities—logic resources, RAM, I/O count, supply and temperature specifications—backed by AMD manufacturing and RoHS compliance.

Request a quote or contact sales to confirm availability, pricing and lead times for the XC4044XL-09BG352C.