XC4044XL-1BG352C

IC FPGA 289 I/O 352MBGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 289 51200 3800 352-LBGA Exposed Pad, Metal

Quantity 222 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O289Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1600Number of Logic Elements/Cells3800
Number of Gates44000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200

Overview of XC4044XL-1BG352C – Field Programmable Gate Array (FPGA)

The XC4044XL-1BG352C is a commercial-grade FPGA in the XC4000E/X family from AMD. It provides a mid-range programmable logic resource set including logic cells, on-chip RAM and a high I/O count in a 352-LBGA exposed-pad package.

Designed for surface-mount applications, the device operates from a 3.0 V to 3.6 V supply and across a 0 °C to 85 °C commercial temperature range, with RoHS compliance for environmental regulation alignment.

Key Features

  • Logic Capacity — Approximately 3,800 logic elements available for implementing user logic and state machines.
  • Configurable Logic Blocks (CLBs) — 1,600 CLBs to structure and partition logic functions efficiently on-chip.
  • Embedded Memory — 51,200 bits of on-chip RAM, providing approximately 0.05 Mbits of embedded memory for buffering, FIFOs, and small data stores.
  • I/O Resources — 289 general-purpose I/O pins to support broad interfacing requirements with external devices and peripherals.
  • Gate Equivalent — Equivalent of 44,000 gates to quantify overall integration density.
  • Package & Mounting — 352-LBGA exposed pad, metal package (supplier package: 352-MBGA 35×35) in a surface-mount format suitable for compact PCB layouts.
  • Power & Temperature — Operates from 3.0 V to 3.6 V and across a commercial temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant to meet common environmental requirements for electronic assemblies.

Unique Advantages

  • Balanced logic and memory footprint: The combination of ~3,800 logic elements and 51,200 bits of embedded RAM supports mixed logic and small-data buffering needs without external memory in many designs.
  • High I/O density: 289 I/O pins enable extensive peripheral and bus interfacing, reducing the need for additional I/O expanders.
  • Compact board-level integration: The 352-LBGA exposed-pad package with surface-mount mounting allows dense PCB routing and thermal contact through the exposed pad.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching typical commercial embedded and industrial-adjacent applications.
  • Clear power envelope: Single-supply operation between 3.0 V and 3.6 V simplifies power-supply design and compatibility with common system rails.

Why Choose XC4044XL-1BG352C?

The XC4044XL-1BG352C offers a practical mix of programmable logic, embedded memory, and a high I/O count in a compact 352-LBGA package, making it suitable for designs that require mid-level integration and flexible interfacing. Its commercial-grade temperature range and RoHS compliance provide straightforward deployment in volume electronic products.

This device is a fit for teams seeking a manufacturable FPGA option from AMD that balances logic density, on-chip RAM, and board-level packaging for a variety of embedded applications where a 3.0 V–3.6 V supply and up to 289 I/Os are required.

Request a quote or submit a purchase inquiry to get pricing and availability for the XC4044XL-1BG352C.

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