XC4044XL-1HQ240C

IC FPGA 193 I/O 240QFP
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 193 51200 3800 240-BFQFP Exposed Pad

Quantity 558 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O193Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1600Number of Logic Elements/Cells3800
Number of Gates44000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200

Overview of XC4044XL-1HQ240C – XC4000E/X FPGA, 240-BFQFP Exposed Pad

The XC4044XL-1HQ240C is a commercial-grade Field Programmable Gate Array (FPGA) from AMD's XC4000E/X family. It provides a mid-range programmable logic resource set in a 240-pin BFQFP package with an exposed pad for thermal performance.

This device targets designers who need a balance of logic capacity, on-chip RAM and high I/O count within a standard surface-mount package and a 3.0 V to 3.6 V supply range.

Key Features

  • Logic Capacity — Provides 3,800 logic elements and approximately 44,000 gates for implementing medium-complexity digital functions.
  • On-Chip Memory — Total on-chip RAM of 51,200 bits, suitable for small buffers, state storage, and control structures.
  • I/O Density — 193 I/O pins to support multiple interfaces, parallel buses, and I/O-intensive applications.
  • Power — Operates from a 3.0 V to 3.6 V supply range, compatible with common commercial power rails.
  • Package — 240-BFQFP exposed pad (Supplier device package: 240-PQFP, 32×32 mm) in a surface-mount form factor for PCB assembly.
  • Temperature and Grade — Commercial temperature rating of 0 °C to 85 °C; suitable for standard commercial environments.
  • Compliance — RoHS compliant for environmental regulatory alignment.

Typical Applications

  • Digital Prototyping and Development — Use the 3,800 logic elements and on-chip RAM to prototype and iterate medium-complexity digital designs.
  • I/O-Intensive Interfaces — 193 I/O pins enable implementation of multi-channel interfaces and parallel bus glue logic.
  • Embedded Control Logic — Implement custom control and sequencing functions where compact on-chip RAM and moderate gate count are sufficient.
  • Integration and Glue Logic — Bridge and adapt signals between subsystems while keeping BOM count low with on-chip resources.

Unique Advantages

  • Balanced Logic and Memory: 3,800 logic elements and 51,200 bits of RAM provide a well-rounded resource mix for medium-complexity designs.
  • High Pin Count in a Compact Package: 193 I/O in a 240-pin BFQFP exposed pad package enables dense I/O routing without resorting to larger packages.
  • Standard Commercial Compatibility: 0 °C to 85 °C operating range and 3.0 V–3.6 V supply make the device suitable for mainstream commercial electronics.
  • Surface-Mount Assembly Friendly: 240-PQFP (32×32) supplier package supports common PCB assembly flows for volume manufacturing.
  • RoHS Compliant: Environmentally compliant construction supports regulatory requirements for many product lines.

Why Choose XC4044XL-1HQ240C?

The XC4044XL-1HQ240C offers a balanced combination of logic resources, embedded RAM and a high I/O count in a commercially rated surface-mount package. It is well suited to designers who require mid-range programmable logic for prototyping, interface implementation and embedded control tasks without stepping up to larger device families.

As part of the XC4000E/X family from AMD, this device provides predictable integration in systems that need a compact footprint, RoHS compliance and standard commercial temperature operation.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4044XL-1HQ240C.

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